66份Electronics工作在Bayan Lepas - September 2026

显示66个工作的结果 "electronics" Bayan Lepas
不要错过任何 Electronics 的新工作机会 在 Bayan Lepas
MYR2,200 - MYR2,500 每月
+额外补偿
Fresh Graduates
  • Technician or Freshie from Diploma / Degree Electrical or Electronic or Mechatronic
  • Excellent working knowledge of semiconductor manufacturing equipment, especially RF Matching Networks and Generators
  • Able to work on shift ...
Troubleshooting Testing
+2

最后机会申请此工作。

Posted
17 days ago
MYR2,500 - MYR3,300 每月
  • Bachelor’s Degree in Electrical & Electronics Engineering or related field
  • Minimum 1-3 years of experience
  • Understanding of electronic test procedures and specifications ...
Electrical Engineering Electronics Engineering
+1
Posted
2 months ago
MYR2,300 - MYR3,500 每月
  • Diploma in Mechatronics, Electrical, Electronic Engineering, or a related field.
  • Basic knowledge of industrial equipment maintenance and troubleshooting.
  • Able to read and follow technical drawings, schematics, and work instructions. ...
Equipment Maintenance Troubleshooting
+1

最后机会申请此工作。

Posted
3 days ago
MYR2,100 - MYR4,000 每月
Fresh Graduates
  • Diploma or Equivalence qualification in Electronic or Mechatronic
  • Punctuality and good working attitude.
  • Must be willing to work on rotating shift and night shift when required. ...

最后机会申请此工作。

Posted
5 days ago
Undisclosed
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia.
  • Employment Type : Full time ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Experienced in AOI process and able to perform troubleshooting, set-up, conversion and recipe creation.
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia. ...
Posted
a month ago
Undisclosed
  • Qualification & Experience: Diploma holder in Engineering or any related discipline. Relevant working experience is preferred.
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia. ...
Posted
a month ago
Undisclosed
  • Degree in Mechanical & Electrical Engineering / Mechatronic Engineering / Electrical & Electronics Engineering.
  • At least 1-2 years of experience in relevant fields.
  • Familiar with equipment operation and know basic maintenance of production equipment/machine. ...
Posted
a month ago
Undisclosed
  • Diploma or any certificated related discipline with 3 years working experience.
  • Job Overview:
  • To ensure the product or material tested meeting the customer requirements with good quality and production ...

最后机会申请此工作。

Posted
18 days ago
Undisclosed
  • Perform conversion at least 2 models of Pick & place handlers.
  • Setup test equipment within allocated time period without compromising quality.
  • Immediately report any quality/ major issues encountered to Module Leader for next course of action ...

最后机会申请此工作。

Posted
18 days ago
Undisclosed
  • To support wire bond process engineering works and carry out yield, quality, cost savings, productivity improvements and documentation.
  • Degree in related discipline with min 5 years relevant working experience or graduate with the degree in any Electronics, Electrical, Mechanical or Mechatronics engineering course.
  • Job Overview: ...
Troubleshooting process engineering
+1

最后机会申请此工作。

Posted
18 days ago
Undisclosed
  • Experienced in AOI process and able to perform troubleshooting, set-up, conversion and recipe creation.
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia.
  • Employment Type : Full time ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Diploma in related discipline with min 3 years relevant working experience or ;
  • Technical Cert with min 4 years relevant working experience or ;
  • SPM / SPMV with min 5 years relevant working experience. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Qualification & Experience: Diploma holder in Engineering or any related discipline. Relevant working experience is preferred.
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Minimum qualification is a Diploma in Electronics/Microelectronics.
  • The candidate should have Failure Analysis experience in Package or Die level FA or Reliability analysis experience for a minimum of 1 year and above in semiconductor manufacturing related company.
  • Well versed in using FA & Rel related equipment such as Microscope, Parametric Analyzer, X-ray, CSAM, SEM-EDX, Decapper, TDR, Micro Prober station, FTIR, HAST, Bake oven, Reflow machine, TC chamber, Burn in oven and etc. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
  • Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
  • Education Requirement: ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Degree in related discipline or Diploma with 4 years relevant working experience.
  • Degree in related discipline or Diploma with 4 years relevant working experience.
  • Job Overview : ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Diploma in Electrical/Electronic/Mechanical.
  • Minimum 2 years working experiences in related field.
  • Experience in Package Saw process. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Experienced in Wirebond process and able to perform troubleshooting, set-up, conversion and recipe creation.
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Diploma in Electrical/Electronics/Mechanical Engineering.
  • Basic knowledge in Molding process (Hydraulic and servo system,)
  • Able to read schematic diagram. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Experienced in Wirebond process and able to perform troubleshooting, set-up, conversion and recipe creation.
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Experienced in Wirebond process and able to perform troubleshooting, set-up, conversion and recipe creation.
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Experienced in Wirebond process and able to perform troubleshooting, set-up, conversion and recipe creation.
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Experienced in Wirebond process and able to perform troubleshooting, set-up, conversion and recipe creation.
  • Employment Type : Full time
  • Fluent in English, and Bahasa Malaysia. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Degree in related discipline or Diploma with 3 years related working experience.
  • AutoCad application knowledge will be an advantage.
  • Qualification & Experience: ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Fresh graduate with degree holder of Bachelor of Science or Engineering.
  • NPI and Project Management experiences. Familiar with Semiconductor manufacturing processes.
  • Qualification & Experience : ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Degree in Mechanical/ Electronics / Electrical /Mechanical Engineering.
  • Min 2 years in semiconductor industry in the field of assembly engineering.
  • Experience in die/glass attach process. ...

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Qualification & Experience : 1. AutoCAD drafting 2. Operate Cadence APD 3. Basic Design Manufacturing Process knowledge. 4. MS. Office 5. Operate GC Prevue 6. Degree in related discipline or 7. Diploma with 4 years relevant working experience.

最后机会申请此工作。

Posted
a month ago
Undisclosed
  • Education Requirement: Degree in engineering field with CGPA 3.2 and above
  • Additional Desirable Qualifications: Fresh Grad/Min 1 years relevant working experience in semiconductor / Electronics manufacturing environment.
  • Education Requirement: Degree in engineering field with CGPA 3.2 and above ...

最后机会申请此工作。

Posted
a month ago