19 Semiconductor Packaging Jobs in Malaysia | Job Vacancies | June 2026

Translate customer requirements into internal equipment specifications.
Develop and optimize TCB process parameters on TCB Equipments.
Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration. ...

Posted

19 days ago

Senior Application - Technical Sales Engineer (Semiconductor Packaging - Flip Chip Bonding) - YZ11 Senior Application - Technical Sales Engineer (Semiconductor Packaging - Flip Chip Bonding) - YZ11

THE SUPREME HR ADVISORY PTE. LTD.

SGD7,000 - SGD7,000 Per Month

Full Time

Singapore

Translate customer requirements into internal equipment specifications.
Develop and optimize TCB process parameters on TCB Equipments.
Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration. ...

Posted

19 days ago

Senior Sales Engineer (Packaging-Semiconductor) Senior Sales Engineer (Packaging-Semiconductor)

MVC Resources

Undisclosed

Full Time

Perai

Posted

5 days ago

Senior Sales Engineer (Packaging-Semiconductor) Senior Sales Engineer (Packaging-Semiconductor)

MVC Resources

Undisclosed

Full Time

Prai

Prepare quotations, proposals, and commercial presentations while following up closely on sales opportunities.
Build and maintain strong relationships with existing customers to ensure long-term business retention and growth.
Serve as a key contact for customers, ensuring prompt response to inquiries, issue resolution, and service excellence. ...

Posted

11 days ago

Research Fellow (Semiconductor Advanced Packaging) Research Fellow (Semiconductor Advanced Packaging)

NANYANG TECHNOLOGICAL UNIVERSITY

SGD6,000 - SGD6,000 Per Month

Full Time

Singapore

Validate reliability and scalability via thermal cycling/HTS/electrical stress on test vehicles; build prototype stacks (e.g., interposer/test-chip) to evidence manufacturability.
Report and collaborate: produce clear technical reports/presentations, coordinate with partners, and maintain rigorous documentation, version control, and safety compliance.
PhD in Materials/ Microelectronics/ EEE/ or related. ...

Posted

a month ago

Research Fellow (Semiconductor Advanced Packaging) Research Fellow (Semiconductor Advanced Packaging)

Nanyang Technological University Singapore

Undisclosed

Full Time

Singapore

Validate reliability and scalability via thermal cycling/HTS/electrical stress on test vehicles; build prototype stacks (e.g., interposer/test-chip) to evidence manufacturability.
Report and collaborate: produce clear technical reports/presentations, coordinate with partners, and maintain rigorous documentation, version control, and safety compliance.
PhD in Materials/ Microelectronics/ EEE/ or related. ...

Posted

a month ago

Field Engineer (Advanced Packaging) Field Engineer (Advanced Packaging)

Tokyo Electron Singapore Pte Ltd

SGD3,400 - SGD5,000 Per Month

Full Time

Singapore

Expected to acquire first-level troubleshooting capabilities
Follow structured diagnostic approaches and established workflows
Maintain clear, accurate and structured records of troubleshooting incidents that meet manufacturing-grade traceability standards and supports downstream analysis ...

Posted

9 days ago

Senior Research Engineer, Adv Pkg Eng Ops (FAB), IME Senior Research Engineer, Adv Pkg Eng Ops (FAB), IME

A*STAR - Agency For Science, Technology And Research

Undisclosed

Full Time

Singapore

Monitor and control key KPIs including wafer thickness uniformity, die strength, chipping, cracking, mold voids, warpage, package yield, and defectivity.
Perform rapid troubleshooting, root cause analysis, and corrective actions to maintain tool uptime and process stability.
Test Operations & Yield Analysis ...

Posted

11 days ago

Engineer, Senior (Technology Integration - Wafer-level Packaging) Engineer, Senior (Technology Integration - Wafer-level Packaging)

Qualcomm

Undisclosed

Full Time

Singapore

Collaborate and develop effective working relationships with technology partners to accomplish project/ task goals within committed schedule.
Develop new and impactful ideas, materials, solutions, and/ or procedures for product fabrication process and technology meeting the business goals and launch schedule with competitive manufacturing costs.
Serve as technology subject matter expert applying technical knowledge and skills in own area of expertise to address moderately complex issues in manufacturing environment. ...

Posted

15 days ago

Process- Equipment Technician (Advanced Packaging- Fan Out Team) Process- Equipment Technician (Advanced Packaging- Fan Out Team)

TF-AMD Penang

Undisclosed

Full Time

Malaysia

Ensure spec compliance and follow OCAP for machine troubleshooting.
Demonstrates flexibility/adaptability to frequent changes.
Able to work in a rotational shift work as and when needed. ...

Posted

a month ago

Senior Flip Chip Manufacturing Process Engineer Senior Flip Chip Manufacturing Process Engineer

Texas Instruments

Undisclosed

Full Time

Malacca City

Support die attach processes for customer deliverable materials. (i.e. specialization for flip chip packages)
Document die attach process details in specification(s) and work instructions
Define applicable die attach materials for specific applications (flux, solder paste, bumps, etc.) ...

Posted

10 days ago

Process- Equipment Engineer (Advanced Packaging- Fan Out) Process- Equipment Engineer (Advanced Packaging- Fan Out)

TF-AMD Penang

Undisclosed

Full Time

Malaysia

Responsible for the work specification definition of production line OP and update the SOP
Responsible for yield and SPC improvement
Responsible for the optimization and maintenance of FMEA/OCPA/SPEC ...

Posted

a month ago

Packaging Engineer, Senior Packaging Engineer, Senior

Qualcomm

Undisclosed

Full Time

台灣

Applies Package System Design and Technology knowledge to drive package product design layout, design multi-physics optimizations, design verification (DV), design tool flow development and tape out of discrete package or Module/SiP for all forms of bare silicon products (single or multi-die).
Assists package to system cooling architecture through simulations; assists in silicon and package product tapeouts, ensuring the thermal package system meets targeted performance, quality, reliability, and cost targets.
Performs package to system electrical analysis and simulations for digital IP, analog IP and external components; supports SIPI, analog and PDN solution development across SoC, substrate, interposer, components and system platforms; assists in package to system tapeout preparation to meet electrical performance, quality, reliability, and cost goals. ...

Posted

a month ago

Process Development Engineer (Wire bond Package R-D) Process Development Engineer (Wire bond Package R-D)

Nexperia Germany Gmbh

Undisclosed

Full Time

Seremban

Lead technical discussions and troubleshooting on wire bond and related FOL processes across project teams and sites
Apply wafer metallization knowledge to optimize process performance and stability
Conduct benchmarking and technology studies to support package roadmap and continuous improvement initiatives ...

Posted

a month ago

Process Development Engineer (Wire bond Package R-D) Process Development Engineer (Wire bond Package R-D)

Nexperia Germany GmbH

Undisclosed

Full Time

Seremban

Drive end-to-end process development from concept to stable, high-yield manufacturing solutions
Provide technical input for assembly processes and equipment solutions for new products and platforms
Lead technical discussions and troubleshooting on wire bond and related FOL processes across project teams and sites ...

Posted

a month ago