Analyze process and metrology data to identify improvement opportunities, drive root-cause analysis, and implement robust corrective and preventive actions (CAPA) to enhance yield, throughput, and process stability.
Assist in MEMS technology development, focusing on the setup and optimization of Photolithography, Screen Printing, and Bonding processes in a semiconductor environment.
Assist in the development, characterization, and optimization of Photolithography, Screen Printing, and Bonding processes for semiconductor manufacturing.
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Perform structured hardware and process characterization, including experiments on flow, contact design, waveform, and chemistry conditions.
Lead troubleshooting and excursion management, conduct systematic root‑cause analysis, and implement permanent corrective and preventive actions.
Bachelor’s or Master’s degree in Electrical/Electronic Engineering, Microelectronics, Materials Science, Applied Physics, Chemical or Mechanical Engineering, or a related discipline.
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Manage and monitor equipment performance using Statistical Process Control (SPC).
Work with Engineer to perform analysis and follow-up on all reported fab yields and D0 problems.
Follow up on PM/CM qualifications to ensure equipment operates within specifications and can be returned to Manufacturing in the shortest possible time.
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Actively contribute to technical projects and work closely with engineers from other departments.
Bachelor’s degree in Electrical and Electronic Engineering, Electrical Engineering, Computer Science, Computer Engineering, Microelectronics, Physics, Materials Science, or Chemical Engineering.
Strong verbal and written communication skills in English and Mandarin.
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