Sustaining (Post-Project Phase): Transition to a production role to manage equipment reliability, troubleshoot MES-related equipment issues, and leverage your implementation knowledge to drive continuous improvement in automation and uptime.
Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree
Strong hands-on semiconductor equipment experience in Wire Bond and/or Die Attach, with minimum 2 years of relevant experience
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He/She assumes the technical responsibility of all piping design and piping support activities for his project.
In the case of Stress, Material Handling, HFE and Material engineering activities, Stress, Material Handling, HFE and Material Lead Engineers shall take responsibility for their technical aspects. They shall liaise with the Piping Lead Engineer for scope and schedule related activities and coordination with Project Team and Client.