11 Packaging Engineer Jobs in Seremban - June 2026 - High Salaries

Showing 11 jobs results for "packaging engineer" in Seremban

Never miss any updates for Packaging Engineer jobs

Undisclosed
  • Responsible for internal/external package structure with designer, materials, assembly process flow and cost structure to meet the development goal.
  • Familiar with DFM, to secure robust manufacturability with quality requirements.
  • Good understanding of power module package design rule, design rule update with new platform development. ...
Posted
9 days ago
Undisclosed
  • Experienced areas: Power module package (pkg sintering / pkg soldering) development, B2S / B6S experience is plus.
  • Experienced packages: Power module package (pkg sintering / pkg soldering)
  • Education: BS or MS degree. ...
Posted
a month ago
Undisclosed
  • Own project planning, scheduling, risk management, and cross‑functional coordination to drive alignment and timely issue resolution.
  • Provide EBR planning, project visibility, and management reporting, supporting phase‑gate readiness and continuous improvement.
  • Bachelor’s degree in Engineering (Mechanical, Manufacturing, Electrical, Chemical, or related). ...
Posted
2 days ago
Undisclosed
  • Own project planning, scheduling, risk management, and cross‑functional coordination to drive alignment and timely issue resolution.
  • Provide EBR planning, project visibility, and management reporting, supporting phase‑gate readiness and continuous improvement.
  • Bachelor’s degree in Engineering (Mechanical, Manufacturing, Electrical, Chemical, or related). ...
Posted
2 days ago
Undisclosed
  • Ensure compliance with industry standards such as JEDEC and AEC-Q100/Q101 (automotive), as well as internal design guidelines
  • Apply solid understanding of semiconductor assembly processes including die attach, wire bonding (gold/copper/silver), and molding/encapsulation
  • Understand lead frame materials and surface finishing/plating techniques (e.g., Ag, NiPdAu, Sn) to ensure reliability and solderability ...
Posted
20 days ago
Undisclosed
  • Work closely with Package Architects to develop technical assembly drawings
  • Define and finalize dimensions and tolerances based on assembly capability, package technology, and lead frame fabrication design rules
  • Ensure compliance with industry standards such as JEDEC and AEC-Q100/Q101 (automotive), as well as internal design guidelines ...
Posted
20 days ago
Undisclosed
  • Lead and manage NPI project execution across NPD, EFK T10 transfer, and engineering builds to ensure on‑time, on‑target delivery.
  • Own project planning, scheduling, risk management, and cross‑functional coordination to drive alignment and timely issue resolution.
  • Provide EBR planning, project visibility, and management reporting, supporting phase‑gate readiness and continuous improvement. ...
Posted
23 days ago
Undisclosed
  • Lead technical discussions and troubleshooting on wire bond and related FOL processes across project teams and sites
  • Apply wafer metallization knowledge to optimize process performance and stability
  • Conduct benchmarking and technology studies to support package roadmap and continuous improvement initiatives ...
Posted
20 days ago
Undisclosed
  • Drive end-to-end process development from concept to stable, high-yield manufacturing solutions
  • Provide technical input for assembly processes and equipment solutions for new products and platforms
  • Lead technical discussions and troubleshooting on wire bond and related FOL processes across project teams and sites ...
Posted
20 days ago
Undisclosed
  • Lead and manage NPI project execution across NPD, EFK T10 transfer, and engineering builds to ensure on‑time, on‑target delivery.
  • Own project planning, scheduling, risk management, and cross‑functional coordination to drive alignment and timely issue resolution.
  • Provide EBR planning, project visibility, and management reporting, supporting phase‑gate readiness and continuous improvement. ...
Posted
23 days ago
Undisclosed
  • Lead technical discussions and troubleshooting on wire bond and related FOL processes across project teams and sites
  • Apply wafer metallization knowledge to optimize process performance and stability
  • Conduct benchmarking and technology studies to support package roadmap and continuous improvement initiatives ...
Posted
25 days ago

Browse "packaging engineer" Job By:

Browse "packaging engineer" Job By: