Supports the development and execution of experimentation and testing to enable characterization, optimization and troubleshooting of processes and equipment. and summarizes, analyses and draws conclusions from test results leading to effective technical resolution.
Knowledgeable in the Die preparation, Back Grinding, Sawing and machine troubleshooting with any additional wafer equipment knowledge. Qualifications REQUIRED:
Data-Driven Problem Solving: Utilize data analysis skills, statistical tools, and Six Sigma methodologies to investigate test data, troubleshoot manufacturing bottlenecks, and optimize reliability.
Coordinates/directs the introduction of new processes, equipment and materials including installation, calibration, EHS assessment debug, and all associated process and quality system documentation requirements including technical and process work instructions.