Facilitate Kaizen, Value Stream Mapping (VSM), and other related activities/workshops to promote a culture of continuous improvement and operational excellence.
Coach and mentor Green Belts and project teams to build organizational capability.
Partner with business leaders to identify and prioritize strategic improvement opportunities.
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Solid background in applied mechanics, especially computational and/or experimental solid mechanics, is required. In-depth knowledge of IC packaging is highly desired.
Ph.D. in Mechanical Engineering plus >3 year, or M.S. in Mechanical Engineering plus >5 years
Solid knowledge through academic coursework or experience required in mechanical engineering of IC packaging and related areas.
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Advanced Model Development: Design and optimize state-of-the-art deep learning models for classification, object detection, and segmentation (e.g., YOLO, transformers, custom CNNs).
Data Infrastructure Leadership: Build, scale, and maintain high-throughput image processing and IoT data pipelines handling massive machine and sensor datasets.
Root Cause & Predictive Analytics: Spearhead advanced data analysis and deep-dive root cause investigations to solve critical manufacturing anomalies and drive continuous process yield improvement.
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Drive supplier resolution of device failures via the 8D method and valid the effectiveness of CAPA.
Coordinate with Program Management, Design Engineering, Procurement and Factory for successful program execution with multiple suppliers, making recommendations on supplier selection.
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