Utilize expertise in process integration between Fabrication (FAB) facilities and Outsourced Semiconductor Assembly and Test (OSAT) companies to anticipate and address potential integration challenges.
In-depth knowledge of Backend-of-the-Line (BEOL) processes, with an additional benefit on experience in photolithography techniques.
Conversant with substrate and assembly packaging processes for RF-SiP (Radio Frequency-System in Package) applications.
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Initiate and participate actively in discussions on formulation of process technology innovation and release process improvement.
Collaborate and develop effective working relationships with technology partners to accomplish project/ task goals within committed schedule.
Develop new and impactful ideas, materials, solutions, and/ or procedures for product fabrication process and technology meeting the business goals and launch schedule with competitive manufacturing costs.
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