- Yishun North Region (Singapore) Singapore
STATS CHIPPAC MANAGEMENT PTE. LTD. Hiring! Full Time R-D Singulation-Dicing Process Engineer in North Region (Singapore), Earn up to SGD 6,000 - Ricebowl
R-D Singulation-Dicing Process Engineer
STATS CHIPPAC MANAGEMENT PTE. LTD.
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Job Description
Responsibilities
About the role
Develop, optimize, and stabilize wafer/package separation processes, including Laser Grooving, Stealth Dicing, Blade Dicing, and Molded Wafer Singulation, for advanced semiconductor packaging. Drive process readiness, yield improvement, robustness, and customer-specific technical solutions toward production.
Key responsibilities
Develop and qualify separation processes for 2.5D, Fan-In, Fan-Out, and eBar technologies
Lead DOE, process optimization, characterization, and continuous improvement using statistical tools such as JMP
Perform hands-on process setup and optimization of Laser Groove, Stealth Dicing, and Blade Dicing equipment
Drive process validation, yield stabilization, troubleshooting, and root-cause analysis
Develop/review FMEA, OCAP, and Control Plans to mitigate process risks and support LVM readiness
Provide technical support for customer programs, including feasibility evaluation and issue resolution
Collaborate with cross-functional teams including R&D, Process Engineering, Equipment, Quality, and Operations to drive process qualification, technology transfer, and manufacturing readiness
About you
Bachelor's degree in Engineering (Mechanical/Materials/Electronics)
3-5 years of hands-on experience in process engineering in semiconductor manufacturing
Fundamental understanding of advanced semiconductor fabrication and integration processes
Proficiency in preparing technical documentation and delivering presentations
Experience in Si Photonics applications, backgrinding, CMP, and planarization is an added advantage
Develop, optimize, and stabilize wafer/package separation processes, including Laser Grooving, Stealth Dicing, Blade Dicing, and Molded Wafer Singulation, for advanced semiconductor packaging. Drive process readiness, yield improvement, robustness, and customer-specific technical solutions toward production.
Key responsibilities
Develop and qualify separation processes for 2.5D, Fan-In, Fan-Out, and eBar technologies
Lead DOE, process optimization, characterization, and continuous improvement using statistical tools such as JMP
Perform hands-on process setup and optimization of Laser Groove, Stealth Dicing, and Blade Dicing equipment
Drive process validation, yield stabilization, troubleshooting, and root-cause analysis
Develop/review FMEA, OCAP, and Control Plans to mitigate process risks and support LVM readiness
Provide technical support for customer programs, including feasibility evaluation and issue resolution
Collaborate with cross-functional teams including R&D, Process Engineering, Equipment, Quality, and Operations to drive process qualification, technology transfer, and manufacturing readiness
About you
Bachelor's degree in Engineering (Mechanical/Materials/Electronics)
3-5 years of hands-on experience in process engineering in semiconductor manufacturing
Fundamental understanding of advanced semiconductor fabrication and integration processes
Proficiency in preparing technical documentation and delivering presentations
Experience in Si Photonics applications, backgrinding, CMP, and planarization is an added advantage
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