- Yishun North Region (Singapore) Singapore
STATS CHIPPAC MANAGEMENT PTE. LTD. Hiring! Full Time Equipment Engineer – Bumping in North Region (Singapore), Earn up to SGD 6,500 - Ricebowl
Equipment Engineer – Bumping
STATS CHIPPAC MANAGEMENT PTE. LTD.
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Job Description
Responsibilities
About the role
To manage, operate, and maintain all core Bumping process equipment and associated utility interfaces to ensure maximum tool availability and operational stability. To execute routine preventive maintenance (PM), drive rapid breakdown troubleshooting, and lead tool qualification/hook-up for Bumping line equipment, leveraging a comprehensive technical understanding of full-line bumping operations.
Key responsibilities
Bumping Line Equipment & Utility Operation
Preventive Maintenance (PM) & Unplanned Breakdown Troubleshooting
Tool Hook-up, Setup & New Equipment Qualification
Equipment OEE Optimization & Spare Parts Management
Bumping Process Tool Failure Analysis (FA) & Yield Support
Equipment & Facility Vendor Technical Support Management
About you
Bachelor's degree or higher in Mechanical Engineering, Electrical/Electronic Engineering, Chemical Engineering, Material Science, or related disciplines
R&D or mass production experience of at least eight years in semiconductor equipment engineering, specifically in Bumping, MEOL, or 2.5D/3D advanced packaging (CoW)
Proven experience in leading and managing engineering teams, allocating resources, and overseeing daily line/equipment operations
In-depth technical knowledge of semiconductor equipment setup, hook-up, preventive maintenance (PM), and utility infrastructure (e.g., gases, chemicals, DI water, vacuum)
Strong capability in vendor management, negotiating tool specifications, and driving vendor technical support for new equipment qualification
Excellent problem-solving skills in equipment failure analysis (FA), OEE improvement, and cross-functional collaboration with process and utility teams
Proficiency in technical documentation and reading/writing/presenting in English for senior management and customer interactions
To manage, operate, and maintain all core Bumping process equipment and associated utility interfaces to ensure maximum tool availability and operational stability. To execute routine preventive maintenance (PM), drive rapid breakdown troubleshooting, and lead tool qualification/hook-up for Bumping line equipment, leveraging a comprehensive technical understanding of full-line bumping operations.
Key responsibilities
Bumping Line Equipment & Utility Operation
Preventive Maintenance (PM) & Unplanned Breakdown Troubleshooting
Tool Hook-up, Setup & New Equipment Qualification
Equipment OEE Optimization & Spare Parts Management
Bumping Process Tool Failure Analysis (FA) & Yield Support
Equipment & Facility Vendor Technical Support Management
About you
Bachelor's degree or higher in Mechanical Engineering, Electrical/Electronic Engineering, Chemical Engineering, Material Science, or related disciplines
R&D or mass production experience of at least eight years in semiconductor equipment engineering, specifically in Bumping, MEOL, or 2.5D/3D advanced packaging (CoW)
Proven experience in leading and managing engineering teams, allocating resources, and overseeing daily line/equipment operations
In-depth technical knowledge of semiconductor equipment setup, hook-up, preventive maintenance (PM), and utility infrastructure (e.g., gases, chemicals, DI water, vacuum)
Strong capability in vendor management, negotiating tool specifications, and driving vendor technical support for new equipment qualification
Excellent problem-solving skills in equipment failure analysis (FA), OEE improvement, and cross-functional collaboration with process and utility teams
Proficiency in technical documentation and reading/writing/presenting in English for senior management and customer interactions
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