NXP Hiring! Full Time FE ASSY DIE BOND PROCESS TECHNICIAN in WP Kuala Lumpur - Ricebowl

Key Responsibilities:
 
1.Perform die bond process task on quality hold material
2.Collaborate with equipment & manufacturing team to improve DB processes and techniques.
3.Assist in resolving DB-related issues to minimize production downtime.
 
 
Requirements:
 
1.Diploma or above in Engineering or a related field.
2.Working experience with DB process is preferable and recommended.
3.Strong attention to detail and technical troubleshooting skills.

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