- Pasir Ris East Region (Singapore) Singapore
United Microelectronics Corporation (Singapore Branch) Hiring! Full Time Technology Development Engineer (Advanced Packaging) in East Region (Singapore), Earn up to SGD 7,000 - Ricebowl
Technology Development Engineer (Advanced Packaging)
United Microelectronics Corporation (Singapore Branch)
Share
Save
Working Location
Job Description
Responsibilities
We are looking for a skilled OSAT & AdvancedPackaging Engineer to drive Advanced packaging with external OSAT partners.This role will focus on advanced packaging technologies, ensuring high-quality,cost-effective, and timely product delivery while collaborating withcross-functional team.
Job Responsibilities:
Work on 2.5D/3D packaging platform technologies.
Develop bump, underfill, molding and RDL processes.
Collaborate with internal R&D and OSAT partners to driveHeterogeneous Integration.
New advanced packaging process verification and qualification.
Customer engagement and new product verification
Capability
Knowledge of bumping, molding, dicing, bonding, RDL (RedistributionLayer), and interconnect technologies are plus.
Experienced in 2.5D and 3DIC process development are plus.
Skill on FMEA, control plan, DOE (design of experiment) and problemsolving.
Good communication, self-motived and avid learner
Qualification
Atleast bachelor degree in electronics/electrical/physics/Materials engineeringor other relevant fields.
At least 2 years working experience inOSAT R&D/Packaging/Process engineer or other relevant fields.
ProficientEnglish oral and writing skill.
UMC is a leading global semiconductor foundry company. The company provides high quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI and BCD etc. Most of UMC's 12-in & 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has total 12 fabs in production with combined capacity close to 800,000 wafers per month (8-in equivalent), and all of them are certified with IATF-16949 automotive quality standard.
UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea and Singapore, with worldwide total 20,000 employees.
Job Responsibilities:
Work on 2.5D/3D packaging platform technologies.
Develop bump, underfill, molding and RDL processes.
Collaborate with internal R&D and OSAT partners to driveHeterogeneous Integration.
New advanced packaging process verification and qualification.
Customer engagement and new product verification
Capability
Knowledge of bumping, molding, dicing, bonding, RDL (RedistributionLayer), and interconnect technologies are plus.
Experienced in 2.5D and 3DIC process development are plus.
Skill on FMEA, control plan, DOE (design of experiment) and problemsolving.
Good communication, self-motived and avid learner
Qualification
Atleast bachelor degree in electronics/electrical/physics/Materials engineeringor other relevant fields.
At least 2 years working experience inOSAT R&D/Packaging/Process engineer or other relevant fields.
ProficientEnglish oral and writing skill.
UMC is a leading global semiconductor foundry company. The company provides high quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI and BCD etc. Most of UMC's 12-in & 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has total 12 fabs in production with combined capacity close to 800,000 wafers per month (8-in equivalent), and all of them are certified with IATF-16949 automotive quality standard.
UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea and Singapore, with worldwide total 20,000 employees.
Important Information
Never provide your bank or credit card details when applying for jobs. Do not transfer any money or complete unrelated online surveys. If you see something suspicious, Report this Job ad.
Learn More