- Pasir Ris East Region (Singapore) Singapore
United Microelectronics Corporation (Singapore Branch) Hiring! Full Time Staff Technology Development Engineer in East Region (Singapore), Earn up to SGD 12,000 - Ricebowl
Staff Technology Development Engineer
United Microelectronics Corporation (Singapore Branch)
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Job Description
Responsibilities
Job Responsibilities:
2.5D/3DIC platform development.
New unit module development and devices development.
New process verification and qualification.
New platform DSM setup
Customer engagement and new product verification
Capability
Solid semiconductor process integration and device characterization skills
Semiconductor device physics and analysis skill.
Experienced in 2.5D and 3DIC process development are plus.
Skill on FMEA, control plan, DOE (design of experiment) and problem solving.
Good communication, self-motived and avid learner
Qualification
At least bachelor degree in microelectronics/electronics/electrical/physics/Materials engineering or other relevant fields.
At least 3 years working experience in semiconductor R&D or related foundry experience of integration/process/device engineer.
Working experience: 2.5D and 3DIC integration and device background are plus.
Proficient English oral and writing skill.
UMC is a leading global semiconductor foundry company. The company provides high quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI and BCD etc. Most of UMC's 12-in & 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has total 12 fabs in production with combined capacity close to 800,000 wafers per month (8-in equivalent), and all of them are certified with IATF-16949 automotive quality standard.
UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea and Singapore, with worldwide total 20,000 employees.
2.5D/3DIC platform development.
New unit module development and devices development.
New process verification and qualification.
New platform DSM setup
Customer engagement and new product verification
Capability
Solid semiconductor process integration and device characterization skills
Semiconductor device physics and analysis skill.
Experienced in 2.5D and 3DIC process development are plus.
Skill on FMEA, control plan, DOE (design of experiment) and problem solving.
Good communication, self-motived and avid learner
Qualification
At least bachelor degree in microelectronics/electronics/electrical/physics/Materials engineering or other relevant fields.
At least 3 years working experience in semiconductor R&D or related foundry experience of integration/process/device engineer.
Working experience: 2.5D and 3DIC integration and device background are plus.
Proficient English oral and writing skill.
UMC is a leading global semiconductor foundry company. The company provides high quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI and BCD etc. Most of UMC's 12-in & 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has total 12 fabs in production with combined capacity close to 800,000 wafers per month (8-in equivalent), and all of them are certified with IATF-16949 automotive quality standard.
UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea and Singapore, with worldwide total 20,000 employees.
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