- Yishun North Region (Singapore) Singapore
STATS CHIPPAC MANAGEMENT PTE. LTD. Hiring! Full Time R - D Engineer – Underfill-Cure in North Region (Singapore), Earn up to SGD 6,500 - Ricebowl
R - D Engineer – Underfill-Cure
STATS CHIPPAC MANAGEMENT PTE. LTD.
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Job Description
Responsibilities
About the role
To design, qualify, and optimize advanced underfill processes (e.g., CUF, MUF, NCF/NCP) that meet strict design rules and high-density packaging requirements, ensuring stable, cost-effective, and scalable technology delivery according to the technology roadmap.
Key responsibilities
Advanced Underfill Process development for CoWoS PKG product family and CPO
Dispensing & Material Evaluation / Qualification
Void & Fillet Control
Failure Analysis & Reliability Enhancement
Customer Development & Technology Transfer
Lead assigned projects
Yield Improvement & Yield Failure Analysis (FA)
About you
Bachelor's degree or higher in engineering or science (e.g., Material Science, Chemistry, Chemical Engineering, Electronics, Advanced Materials, etc.)
R&D or mass production experience of at least three years in Underfill processes (e.g., CUF, MUF, NCF/NCP), dispensing, or encapsulation technology
Proven experience in driving customer development programs (e.g., JDP, customer qualification, technical evaluations) and managing customer requirements
Fundamental understanding of advanced semiconductor packaging processes, underfill fluid dynamics, void-free encapsulation, and thermal-mechanical stress control
Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting
Ability to prepare technical documents and deliver presentations to internal and external stakeholders
Proficiency in reading and writing technical documents in English
Basic knowledge of underfill equipment (dispenser, cure oven), epoxy/resin materials, and inspection/reliability characterization tools
To design, qualify, and optimize advanced underfill processes (e.g., CUF, MUF, NCF/NCP) that meet strict design rules and high-density packaging requirements, ensuring stable, cost-effective, and scalable technology delivery according to the technology roadmap.
Key responsibilities
Advanced Underfill Process development for CoWoS PKG product family and CPO
Dispensing & Material Evaluation / Qualification
Void & Fillet Control
Failure Analysis & Reliability Enhancement
Customer Development & Technology Transfer
Lead assigned projects
Yield Improvement & Yield Failure Analysis (FA)
About you
Bachelor's degree or higher in engineering or science (e.g., Material Science, Chemistry, Chemical Engineering, Electronics, Advanced Materials, etc.)
R&D or mass production experience of at least three years in Underfill processes (e.g., CUF, MUF, NCF/NCP), dispensing, or encapsulation technology
Proven experience in driving customer development programs (e.g., JDP, customer qualification, technical evaluations) and managing customer requirements
Fundamental understanding of advanced semiconductor packaging processes, underfill fluid dynamics, void-free encapsulation, and thermal-mechanical stress control
Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting
Ability to prepare technical documents and deliver presentations to internal and external stakeholders
Proficiency in reading and writing technical documents in English
Basic knowledge of underfill equipment (dispenser, cure oven), epoxy/resin materials, and inspection/reliability characterization tools
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