RECRUIT123 PTE. LTD. Hiring! Full Time Test - Packaging Engineering Leader (Semiconductor) in , Earn up to SGD 18,000 - Ricebowl

Test & Packaging Engineering Leader (Semiconductor)

Location: Singapore

Job Description

Our client, a semiconductor manufacturing company, is seeking an experienced leader to lead test and packaging engineering for advanced semiconductor products. This role owns the full test development lifecycle from New Product Introduction through to High Volume Manufacturing transfer and leads a team of engineers supporting production scale-up.

Key Responsibilities

• Lead the New Product Introduction (NPI) effort to develop in-house test solutions, including managing the tester RFQ (Request for Quotation) process
• Own the transfer of qualified test solutions into High Volume Manufacturing (HVM), ensuring smooth handover and production readiness
• Partner with design, process, and packaging engineering teams to define test requirements and specifications for advanced semiconductor products
• Evaluate, select, and manage relationships with test equipment vendors and suppliers
• Drive test yield improvement and cost-of-test reduction initiatives across the product lifecycle
• Establish and maintain test methodologies, standards, and documentation to support scale-up and manufacturing transfer
• Manage project timelines, budgets, and resources for test development programs
• Lead and develop a team of test and packaging engineers
• Collaborate with cross-functional stakeholders (R&D, operations, quality, and supply chain) to ensure alignment on product qualification milestones
• Provide technical guidance on packaging and test integration challenges for advanced semiconductor devices

Requirements

• Bachelor's or Master's degree in Electrical Engineering, Materials Science, or a related field
• Minimum 10 years of experience in test/packaging engineering within the semiconductor industry, with at least 5 years in a managerial or leadership capacity
• Proven track record in NPI, test solution development, and HVM transfer
• Strong understanding of advanced packaging and test processes (e.g., wafer-level/final test, wire bonding, or die attach)
• Experience managing tester RFQ processes and vendor negotiations
• Strong project management, cross-functional collaboration, and stakeholder management skills
• Excellent leadership and people management capabilities

Recruiter: Lian Cher Chieh (Steffan)
UEN: 202511044R
License No.: 25C2810EA
Registration No.: R1217705

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