AEM Holdings Ltd Hiring! Full Time Field Service Engineer I in 台灣 - Ricebowl

As an Application Engineer (FAE) for HPC/AI Test and Burn-in, you will act as the primary technical lead for our most advanced integrated test platforms. You will bridge the gap between internal R&D and leading AI chip customers, tackling the most challenging test and reliability problems in the industry—managing 1000W+ thermal loads and ensuring massive-scale power delivery for advanced chipsets. This role is solution-focused, combining hardware design, software scripting, and semiconductor physics, rather than routine maintenance. You will guide the customer journey from technical validation during the sales cycle through deployment, integration, optimization, and production stability.

Core Responsibilities

Customer Solution Design: Lead discovery sessions with customer R&D/product engineers to identify power and thermal pain points. Define next-generation silicon test requirements.

Technical Proposal Development: Collaborate with Sales on RFP/RFQ technical sections, specifying system configurations, custom hardware, and software requirements.

• Demonstration Leadership: Deliver high-impact demos, customizing test setups to address customer-specific silicon challenges.

Proof of Concept (PoC) & Benchmarking: Execute technical evaluations and competitive “shoot-outs” to demonstrate thermal stability and throughput superiority.

• Test Program Development: Write/debug code for automated power cycling, signal stimulation, temperature profiles, and data logging.
• Software Pattern Conversion: Convert customer test patterns (WGL/STIL) to formats compatible with AEM systems.
• Algorithm Optimization: Develop smart test/burn-in routines to monitor current and temperature in real time to prevent thermal runaway.

Root Cause Analysis: Diagnose issues in failing systems, collaborating with R&D and product teams to resolve problems in silicon, sockets, boards, or software.

• Hardware Integration: Validate test instruments, boards, and interface hardware, ensuring signal integrity and factory automation compatibility.
• Thermal Management: Analyze chip power density, design thermal profiles, and fine-tune PID loops for junction temperature (Tj) stability.
• Technical Training: Train customer engineering teams, create application notes, test procedures, and RCA reports.

Education & Experience

• Bachelor’s or Master’s in Electrical, Computer, or Mechanical Engineering (electronics focus).
• 3–5 years in Semiconductor Test (ATE), Burn-in, SLT, Reliability, or Thermal Mechanical testing in high-performance computing.
• Practical experience in liquid cooling, active heat sinks, TIMs, and PID control loops.
• Proficiency in Java, C#, C++, NetBeans, Baremetal, VBasic, and Microsoft Office.
• Knowledge of JTAG, boundary scan, PCIe Gen5/6, HBM3 interfaces, and SLT/BI protocols.
• Data analysis skills for STDF/CSV files, generating Schmoo plots and statistical reports.
• Fluent in Mandarin and English (speaking, writing, reading, presenting).
• Willingness to travel 50–60% for customer support or training.

Key Traits & Soft Skills

• Strategic problem-solving: Systematically isolate failures across silicon, sockets, software, or power supply.
• Technical resilience: Remain calm under high-pressure, on-site troubleshooting.
• Clear communication: Explain complex failures to technical and non-technical stakeholders.
• Collaborative: Work effectively across sales, engineering, and customer teams.
• Strong interpersonal and relationship-building skills.

Physical Requirements

• Moderate heavy lifting.
• Prolonged periods of standing or sitting at a computer.

About AEM

AEM is a global leader in semiconductor and electronics test solutions, delivering high-performance test handlers, system-level test, and instrumentation to the world’s leading technology companies. Headquartered in Singapore, our teams combine deep engineering expertise with a culture of innovation to solve some of the most complex challenges in advanced manufacturing.