Onsemi Hiring! Full Time Advanced Packaging Designer - Power Modules in 新竹縣, 台灣 - Ricebowl

We are seeking an experienced Packaging Designer to lead the design, development, and optimization of advanced power module packaging solutions. The successful candidate will possess extensive expertise in Advanced Package Design (APD) and 3D modeling , combined with a deep understanding of power module design requirements, including mechanical, thermal, and electrical performance considerations.

This role will collaborate closely with electrical, mechanical, thermal, manufacturing, and product engineering teams to develop innovative packaging solutions that enable high-performance, reliable, and manufacturable power electronic products.

• Responsibilities

Package Design & Development

• Develop and optimize power module package architectures from concept through production release.
• Create detailed APD layouts, package structures, and interconnect designs to meet performance, reliability, and manufacturability requirements.
• Generate and maintain high-quality 3D models, mechanical drawings, and design documentation.
• Lead package design reviews and ensure compliance with product specifications and industry standards.

Cross-Functional Engineering Collaboration

• Work closely with electrical, mechanical, thermal, reliability, and manufacturing engineers to develop integrated packaging solutions.
• Support design trade-off analysis involving package size, cost, thermal performance, electrical performance, and manufacturability.
• Participate in new product development activities and technology roadmaps.
• Mentor junior designers in power design concepts.

Mechanical, Thermal, and Electrical Optimization

• Design packages considering:
  • Thermal management and heat dissipation requirements.
  • Electrical isolation, parasitic inductance, and current-carrying capability.
  • Mechanical robustness, stress management, and reliability under environmental conditions.
• Evaluate material selections, substrate technologies, interconnect methods, encapsulation systems, and cooling approaches.
• Support simulation activities and interpretation of mechanical, thermal, and electrical modeling results.

Design Validation & Manufacturing Support

• Collaborate with manufacturing teams to ensure designs are producible and scalable.
• Support prototype builds, qualification activities, and root-cause analysis of packaging-related failures.
• Drive continuous improvement initiatives focused on performance, reliability, cost, and manufacturability.

• Qualifications

Education

• Bachelor's or Master's degree in Mechanical Engineering, Electrical Engineering, Materials Engineering, Packaging Engineering, or a related field.

Experience

• 5-6+ years of experience in package design, semiconductor packaging, power electronics packaging, or related engineering disciplines.
• Advanced expertise in APD (Advanced Package Designer) and 3D modeling tools .
• Demonstrated experience designing power module packages for industrial, automotive, renewable energy, or high-power applications.

Technical Skills

• Expert proficiency in:
  • Cadence APD (Advanced Package Designer)
  • 3D CAD modeling tools (e.g., SolidWorks (preferred), Creo, or equivalent)
• Strong understanding of:
  • Power module packaging technologies
  • Semiconductor packaging principles
  • DBC, AMB, leadframe, and advanced substrate technologies
  • Wire bond and advanced interconnect technologies
  • Thermal interface materials and cooling solutions
• Strong knowledge of:
  • Mechanical design principles
  • Thermal management and heat transfer
  • Electrical design considerations including creepage, clearance, insulation, and parasitic effects
• Experience interpreting thermal, mechanical, and electrical simulation results.
• Familiarity with design for manufacturability (DFM), design for assembly (DFA), and reliability principles.