- Woodlands North Region (Singapore) Singapore
ASE SINGAPORE PTE. LTD. Hiring! Full Time NPI Engineer - Test Process (WLCSP) in North Region (Singapore), Earn up to SGD 4,500 - Ricebowl
NPI Engineer - Test Process (WLCSP)
ASE SINGAPORE PTE. LTD.
Share
Save
Working Location
Job Description
Responsibilities
Responsibilities
Responsible for set-up and optimization of new device qualification, engineering lot processing, process data gathering and reporting
Monitor and improve device yield performance and process SPC charts
Investigate and troubleshoot production downtime and quality issues to provide lot disposition on outlier lots
Perform engineering report and documentation such as 8D, DMAIC, FMEA, CP, Process Specification, Work Instructions, etc
Implement continuous improvement program (CIP) to support yield and cost improvement, including developing systems for workflow management
Facilitate training of manufacturing personnel on operating procedures and process specification
Work closely with inter-department to improve process and equipment performance and capability
Coordinate and communicate with customers for any process engineering related matters
Setup systems and NPI requirements, handles qualifications and engineering activities
Requirements
Diploma / Degree in any Engineering Discipline
Working experience in semiconductor assembly manufacturing or process engineering and pre-assembly processes (Backgrind, Laser Marking, Laser Groove, Wafer Dicing) is an advantage
Knowledge in SPC, DOE, FMEA, OCAP, Control Plan, WI and Process Specification
Clear and effective communication with customers, suppliers and cross department
Able to multi-task and support ad-hoc projects in process and equipment related activities
Entry level candidates are welcome to apply
The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader geared towards meeting the industry's ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test, program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and design manufacturing services.
Responsible for set-up and optimization of new device qualification, engineering lot processing, process data gathering and reporting
Monitor and improve device yield performance and process SPC charts
Investigate and troubleshoot production downtime and quality issues to provide lot disposition on outlier lots
Perform engineering report and documentation such as 8D, DMAIC, FMEA, CP, Process Specification, Work Instructions, etc
Implement continuous improvement program (CIP) to support yield and cost improvement, including developing systems for workflow management
Facilitate training of manufacturing personnel on operating procedures and process specification
Work closely with inter-department to improve process and equipment performance and capability
Coordinate and communicate with customers for any process engineering related matters
Setup systems and NPI requirements, handles qualifications and engineering activities
Requirements
Diploma / Degree in any Engineering Discipline
Working experience in semiconductor assembly manufacturing or process engineering and pre-assembly processes (Backgrind, Laser Marking, Laser Groove, Wafer Dicing) is an advantage
Knowledge in SPC, DOE, FMEA, OCAP, Control Plan, WI and Process Specification
Clear and effective communication with customers, suppliers and cross department
Able to multi-task and support ad-hoc projects in process and equipment related activities
Entry level candidates are welcome to apply
The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader geared towards meeting the industry's ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test, program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and design manufacturing services.
Important Information
Never provide your bank or credit card details when applying for jobs. Do not transfer any money or complete unrelated online surveys. If you see something suspicious, Report this Job ad.
Learn More