- Singapore
Recruit123 Hiring! Full Time Test - Packaging Engineering Leader (Semiconductor) in , Earn up to SGD 18,000 - Ricebowl
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Location:
Singapore
Job Description
Our client, a semiconductor manufacturing company, is seeking an experienced leader to lead test and packaging engineering for advanced semiconductor products. This role owns the full test development lifecycle from New Product Introduction through to High Volume Manufacturing transfer and leads a team of engineers supporting production scale-up.
Key Responsibilities
Lead the New Product Introduction (NPI) effort to develop in-house test solutions, including managing the tester RFQ (Request for Quotation) process
Own the transfer of qualified test solutions into High Volume Manufacturing (HVM), ensuring smooth handover and production readiness
Partner with design, process, and packaging engineering teams to define test requirements and specifications for advanced semiconductor products
Evaluate, select, and manage relationships with test equipment vendors and suppliers
Drive test yield improvement and cost-of-test reduction initiatives across the product lifecycle
Establish and maintain test methodologies, standards, and documentation to support scale-up and manufacturing transfer
Manage project timelines, budgets, and resources for test development programs
Lead and develop a team of test and packaging engineers
Collaborate with cross-functional stakeholders (R&D, operations, quality, and supply chain) to ensure alignment on product qualification milestones
Provide technical guidance on packaging and test integration challenges for advanced semiconductor devices
Requirements
Bachelor's or Master's degree in Electrical Engineering, Materials Science, or a related field
Minimum 10 years of experience in test/packaging engineering within the semiconductor industry, with at least 5 years in a managerial or leadership capacity
Proven track record in NPI, test solution development, and HVM transfer
Strong understanding of advanced packaging and test processes (e.g., wafer-level/final test, wire bonding, or die attach)
Experience managing tester RFQ processes and vendor negotiations
Strong project management, cross-functional collaboration, and stakeholder management skills
Excellent leadership and people management capabilities
Recruiter: Lian Cher Chieh (Steffan)
UEN: 202511044R
License No.: 25C2810EA
Registration No.: R1217705
At Recruit123, we specialize in connecting exceptional talent with leading companies in South- East Asia.
Our business methodology is to provide a seamless recruitment process as easy as 1, 2, 3
Singapore
Job Description
Our client, a semiconductor manufacturing company, is seeking an experienced leader to lead test and packaging engineering for advanced semiconductor products. This role owns the full test development lifecycle from New Product Introduction through to High Volume Manufacturing transfer and leads a team of engineers supporting production scale-up.
Key Responsibilities
Lead the New Product Introduction (NPI) effort to develop in-house test solutions, including managing the tester RFQ (Request for Quotation) process
Own the transfer of qualified test solutions into High Volume Manufacturing (HVM), ensuring smooth handover and production readiness
Partner with design, process, and packaging engineering teams to define test requirements and specifications for advanced semiconductor products
Evaluate, select, and manage relationships with test equipment vendors and suppliers
Drive test yield improvement and cost-of-test reduction initiatives across the product lifecycle
Establish and maintain test methodologies, standards, and documentation to support scale-up and manufacturing transfer
Manage project timelines, budgets, and resources for test development programs
Lead and develop a team of test and packaging engineers
Collaborate with cross-functional stakeholders (R&D, operations, quality, and supply chain) to ensure alignment on product qualification milestones
Provide technical guidance on packaging and test integration challenges for advanced semiconductor devices
Requirements
Bachelor's or Master's degree in Electrical Engineering, Materials Science, or a related field
Minimum 10 years of experience in test/packaging engineering within the semiconductor industry, with at least 5 years in a managerial or leadership capacity
Proven track record in NPI, test solution development, and HVM transfer
Strong understanding of advanced packaging and test processes (e.g., wafer-level/final test, wire bonding, or die attach)
Experience managing tester RFQ processes and vendor negotiations
Strong project management, cross-functional collaboration, and stakeholder management skills
Excellent leadership and people management capabilities
Recruiter: Lian Cher Chieh (Steffan)
UEN: 202511044R
License No.: 25C2810EA
Registration No.: R1217705
At Recruit123, we specialize in connecting exceptional talent with leading companies in South- East Asia.
Our business methodology is to provide a seamless recruitment process as easy as 1, 2, 3
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