Globetronics Hiring! Full Time Process - Equipment Technician – Assembly - Dicing - Pick - Place-Underfill-Encapsulation in Pulau Pinang, Earn up to MYR 4,500 - Ricebowl

Semiconductor Assembly & Process Technician – FOL / Dicing / Encapsulation

Location: Bayan Lepas, Penang, Malaysia
Employment Type: Permanent | Full-Time

Job Summary

We are seeking an experienced Semiconductor Assembly & Process Technician with hands-on experience in Pick & Place, Dicing, FOL Assembly, Die Bonder, DA & Recon, Curing, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, and Encapsulation processes. The successful candidate will support daily production, equipment setup, process troubleshooting, product changeover, and process improvement to ensure stable and efficient semiconductor manufacturing operations.

Key Responsibilities

• Operate, set up, and monitor semiconductor assembly and manufacturing equipment according to SOPs and work instructions.
• Perform hands-on processes including Pick & Place, Dicing, Die Bonder, DA & Recon, Curing, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, and Encapsulation.
• Support FOL (Front-of-Line) assembly processes and ensure production targets and quality requirements are achieved.
• Perform equipment setup, product changeover, recipe verification, and parameter checks.
• Troubleshoot process and equipment abnormalities and escalate issues to Engineers when required.
• Perform basic equipment adjustments and support preventive maintenance activities.
• Monitor process parameters, machine performance, product quality, and production output.
• Conduct visual inspection and identify defects such as die misalignment, wire defects, voids, delamination, dispensing defects, and assembly-related issues.
• Support engineering trials, NPI, process qualification, product transfer, and improvement activities.
• Maintain accurate production, process, and equipment records.
• Work closely with Production, Process Engineering, Equipment Engineering, and QA teams to resolve production issues.
• Support yield improvement, productivity improvement, 5S, Lean, and continuous improvement activities.
• Ensure compliance with safety, ESD, cleanroom, quality, and company requirements.

Required Skills & Experience

• Minimum SPM / Certificate / Diploma in Engineering, Electronics, Mechanical, Mechatronics, Manufacturing, or related field.
• 1–5 years of hands-on experience in semiconductor, electronics, or manufacturing industry.
• Practical experience in one or more of the following processes:
• Pick & Place
• Dicing / Wafer Sawing
• FOL Assembly
• Die Bonder
• DA & Recon
• Curing / Cure
• Plasma
• Dispensing
• Wire Bonder
• Underfill
• PCB Mounter
• Encapsulation
• Experience with Asymtek / Asymementek dispensing or encapsulation equipment is an added advantage.
• Good understanding of semiconductor assembly processes and equipment operation.
• Able to perform basic machine troubleshooting and process adjustments.
• Willing to work in a cleanroom and shift environment.
• Good teamwork, discipline, attention to detail, and problem-solving skills.

Preferred Technical Skills / Keywords

Pick & Place | Dicing | Wafer Sawing | FOL | Die Bonder | Die Attach | DA & Recon | Curing | Plasma | Dispensing | Wire Bonder | Underfill | PCB Mounter | Encapsulation | Asymtek | Semiconductor Assembly | Backend Semiconductor | Process Technician | Equipment Technician | Machine Setup | Machine Troubleshooting | Recipe Setup | Preventive Maintenance | Yield Improvement | ESD | Cleanroom | 5S

Added Advantage

Candidates with hands-on experience in multiple semiconductor assembly processes will be highly preferred, particularly those with experience across FOL, Dicing, Die Attach, Wire Bonding, Underfill, PCB Mounting, and Encapsulation.

Job Type: Full-time

Pay: RM3,500.00 - RM4,500.00 per month

Benefits:

• Additional leave
• Cell phone reimbursement
• Company car
• Dental insurance
• Flexible schedule
• Free parking
• Health insurance
• Maternity leave
• Opportunities for promotion
• Parental leave
• Professional development

Work Location: In person