UNITED MICROELECTRONICS CORPORATION (SINGAPORE BRANCH) Hiring! Full Time Technology Development Engineer (Advanced Packaging) in East Region (Singapore), Earn up to SGD 4,500 - Ricebowl

We are looking for a skilled OSAT & AdvancedPackaging Engineer to drive Advanced packaging with external OSAT partners.This role will focus on advanced packaging technologies, ensuring high-quality,cost-effective, and timely product delivery while collaborating withcross-functional team.

Job Responsibilities:

• Work on 2.5D/3D packaging platform technologies.
• Develop bump, underfill, molding and RDL processes.
• Collaborate with internal R&D and OSAT partners to driveHeterogeneous Integration.
• New advanced packaging process verification and qualification.
• Customer engagement and new product verification

Capability

• Knowledge of bumping, molding, dicing, bonding, RDL (RedistributionLayer), and interconnect technologies are plus.
• Experienced in 2.5D and 3DIC process development are plus.
• Skill on FMEA, control plan, DOE (design of experiment) and problemsolving.
• Good communication, self-motived and avid learner

Qualification

• Atleast bachelor degree in electronics/electrical/physics/Materials engineeringor other relevant fields.
• At least 2 years working experience inOSAT R&D/Packaging/Process engineer or other relevant fields.
• ProficientEnglish oral and writing skill.