Remoly Hiring! Full Time Senior Staff Engineer - Substrate Designer in Melaka - Ricebowl

Senior Staff Engineer – Substrate Designer

Location: Melaka, Malaysia

Employment Type: Permanent, On-site

Job Function: Research & Development

Job Summary

We are seeking an experienced Senior Staff Engineer – Substrate Designer to lead substrate, lead frame, and packaging-material development for semiconductor package projects. This role ensures designs meet manufacturing, product qualification, reliability, quality, and cost requirements throughout the development cycle.

Key Responsibilities

• Serve as the technical expert for substrate, lead frame, and packaging-material design in semiconductor package development projects.
• Develop designs, drawings, and specifications for substrates and lead frames in accordance with design guidelines, assembly rules, manufacturability, quality, and cost targets.
• Lead multi-layer substrate design activities using Cadence and lead frame design using AutoCAD and/or Autodesk Inventor.
• Collaborate with internal engineering teams and material suppliers to define, select, and qualify packaging materials.
• Drive development activities to achieve project milestones, including documentation release for specifications, drawings, and related technical documents.
• Work closely with Supplier Quality Management, Incoming Quality Assurance, and suppliers to ensure material quality requirements, FAI, and qualification release are fulfilled.
• Establish and maintain design guidelines and technical requirements for substrates, lead frames, and packaging materials.
• Support incoming material quality, root-cause analysis, supplier issue resolution, and continuous-improvement initiatives.
• Engage suppliers to evaluate emerging technologies, cost-effective designs, and materials that strengthen product competitiveness.
• Contribute to technical papers, journals, patents, and other innovations related to substrate, lead frame, and package design.

Qualifications

• Bachelor’s degree in Semiconductor Technology, Microelectronics, Mechanical Engineering, Electrical/Electronics Engineering, Automation, Physics, or a related discipline.
• At least 7 years of experience in semiconductor assembly and packaging development.
• Proven experience in substrate, lead frame, and/or packaging-material design, development, qualification, and reliability.
• Experience designing multi-layer substrates using Cadence.
• Proficiency in 2D and 3D lead frame drafting/design using AutoCAD and/or Autodesk Inventor.
• Strong knowledge of PCB and laminate substrate materials, lead frames, and packaging-material properties.
• Solid understanding of GD&T and material-specification definition.
• Working knowledge of semiconductor packaging, assembly, and test processes.
• Experience with material analysis, qualification, reliability assessment, and supplier quality collaboration.
• Strong analytical, problem-solving, communication, and cross-functional collaboration skills.