- Pasir Ris East Region (Singapore) Singapore
SILICON BOX PTE. LTD. Hiring! Full Time Engineer, Process (Backend) in East Region (Singapore), Earn up to SGD 7,000 - Ricebowl
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Job Description
Responsibilities
Position Summary
The
Process Engineer
is responsible for development and establishment of production process.
Responsibilities
Responsible for Backend process: Pick and Place / SMT and SMD / Ball Drop / Reflow / Laser Marking / Tape and Reel / Singulation / Packing / AOI, etc.
Establish, review and update specifications, workflow, quality and safety related documentation for production line.
Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
Process sustaining and control through SPC and periodic defect Pareto Analysis.
Lead and drive SPC control.
Review and maintain FMEA, Control plan, OCAP with cross-functional teams.
Handle and manage customer audits and 8D reports.
Provide disposition for engineering and production lots.
Conduct process characterization and qualification to establish process baseline.
Coordinate and liaise with vendor/suppliers on process issue or quality issue.
Support customer NPI activities and internal engineering activities.
New material, process & machine development and qualification.
Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line
Any other ad-hoc duties as assigned by supervisor
Requirement
Minimum bachelor's degree in material science, microelectronics, mechanical engineering or relevant engineering field
At least 3 years of experience in semiconductor manufacturing industry and working in cleanroom environment
Hands-on process experience in Backend Process: Pick and Place / SMT and SMD / Ball Drop / Reflow / Laser Marking / Tape and Reel / Singulation / Packing / AOI, etc within semiconductor IC packaging industry
Experience in SPC, DPE, FMEA, OCAP, WI, CPK, PPK, 4D/8D report
Silicon Box Pte Ltd is one of Asia’s fastest growing technology unicorn, at the forefront of semiconductors integration, emerging from the new horizon of Chiplets integration trends in the semiconductor industry, driven by the needs of "dis-integration", benefits of faster time-to-market and lower cost of new device design.
We provide services of semiconductor design of Chiplets at the leading edge of semiconductor device integration scheme with the next generation of advanced packaging manufacturing technologies.
The
Process Engineer
is responsible for development and establishment of production process.
Responsibilities
Responsible for Backend process: Pick and Place / SMT and SMD / Ball Drop / Reflow / Laser Marking / Tape and Reel / Singulation / Packing / AOI, etc.
Establish, review and update specifications, workflow, quality and safety related documentation for production line.
Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
Process sustaining and control through SPC and periodic defect Pareto Analysis.
Lead and drive SPC control.
Review and maintain FMEA, Control plan, OCAP with cross-functional teams.
Handle and manage customer audits and 8D reports.
Provide disposition for engineering and production lots.
Conduct process characterization and qualification to establish process baseline.
Coordinate and liaise with vendor/suppliers on process issue or quality issue.
Support customer NPI activities and internal engineering activities.
New material, process & machine development and qualification.
Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line
Any other ad-hoc duties as assigned by supervisor
Requirement
Minimum bachelor's degree in material science, microelectronics, mechanical engineering or relevant engineering field
At least 3 years of experience in semiconductor manufacturing industry and working in cleanroom environment
Hands-on process experience in Backend Process: Pick and Place / SMT and SMD / Ball Drop / Reflow / Laser Marking / Tape and Reel / Singulation / Packing / AOI, etc within semiconductor IC packaging industry
Experience in SPC, DPE, FMEA, OCAP, WI, CPK, PPK, 4D/8D report
Silicon Box Pte Ltd is one of Asia’s fastest growing technology unicorn, at the forefront of semiconductors integration, emerging from the new horizon of Chiplets integration trends in the semiconductor industry, driven by the needs of "dis-integration", benefits of faster time-to-market and lower cost of new device design.
We provide services of semiconductor design of Chiplets at the leading edge of semiconductor device integration scheme with the next generation of advanced packaging manufacturing technologies.
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