Equipment & Process Engineer – Dispensing & Laser Marking (Semiconductor)
Location: Bayan Lepas, Penang, Malaysia
Employment Type: Permanent | Full-Time
Job Summary
We are seeking an experienced Process Engineer – Dispensing & Laser Marking to support semiconductor manufacturing operations. The successful candidate will be responsible for process development, optimization, troubleshooting, qualification, and continuous improvement of dispensing and laser marking processes to achieve high quality, yield, productivity, and process stability.
Key Responsibilities
- Develop, optimize, and sustain dispensing and laser marking processes for semiconductor manufacturing.
- Set up, program, and optimize dispensing and laser marking equipment and process parameters.
- Troubleshoot process and equipment-related issues and implement corrective actions.
- Optimize dispensing parameters such as dispense volume, pressure, speed, pattern, temperature, and curing conditions.
- Optimize laser marking parameters including laser power, speed, frequency, focus, marking quality, and readability.
- Conduct process qualification, validation, capability studies, and engineering evaluations.
- Analyze process data, defects, and yield performance to identify improvement opportunities.
- Drive yield improvement, cycle-time reduction, productivity, and process capability.
- Support NPI, new equipment introduction, product transfer, and engineering builds.
- Work closely with Production, QA, Equipment Engineering, and NPI teams to resolve manufacturing issues.
- Prepare and maintain SOPs, work instructions, process specifications, control plans, and technical documentation.
- Apply SPC, DOE, PFMEA, 8D, RCA and CAPA for process improvement and problem solving.
- Support continuous improvement initiatives, 5S, Lean Manufacturing, and cost reduction projects.
- Ensure compliance with quality, safety, ESD, and semiconductor manufacturing requirements.
Requirements
- Bachelor’s Degree in Electrical, Electronics, Mechanical, Mechatronics, Manufacturing Engineering or related field.
- 2–5 years of relevant experience in semiconductor, electronics, precision manufacturing, or related industries.
- Hands-on experience in dispensing processes and equipment is required.
- Experience in laser marking / laser engraving processes and equipment is highly preferred.
- Knowledge of semiconductor assembly and manufacturing processes.
- Experience in process troubleshooting, optimization, qualification, and yield improvement.
- Familiar with SPC, DOE, PFMEA, 8D, RCA and CAPA.
- Strong analytical and problem-solving skills.
- Good communication and teamwork skills.
- Able to work independently and effectively in a fast-paced manufacturing environment.
Preferred Technical Skills / Keywords
Dispensing | Dispense Process | Precision Dispensing | Epoxy Dispensing | Adhesive Dispensing | Laser Marking | Laser Engraving | Laser Processing | Semiconductor Assembly | Process Engineering | Process Development | Process Optimization | Yield Improvement | NPI | Process Qualification | SPC | DOE | PFMEA | RCA | 8D | CAPA | Manufacturing Engineering
Advantages
Experience with the following will be an added advantage:
- Die Attach / Underfill / Encapsulation
- Epoxy or adhesive dispensing
- Vision inspection / AOI
- Laser marking equipment and vision alignment
- Curing process
- Semiconductor backend assembly processes
- Equipment programming and recipe optimization
- Process capability and MSA studies
Job Type: Full-time
Pay: RM5,500.00 - RM7,000.00 per month
Benefits:
- Additional leave
- Dental insurance
- Flexible schedule
- Free parking
- Health insurance
- Maternity leave
- Opportunities for promotion
- Parental leave
- Professional development
Work Location: In person