UST Malaysia Hiring! Full Time IC Package Design Engineer (Flip Chip-Substrate) in Pulau Pinang - Ricebowl

Role Overview

We are seeking a highly skilled Package Design Engineer with 5–8 years of experience in advanced IC packaging. The ideal candidate will have strong expertise in Flip Chip and multi-layer substrate (8+ layers) design, with a solid understanding of substrate manufacturing and assembly rules. The role requires close collaboration with cross-functional teams and vendors to deliver high-performance, reliable, and manufacturable package solutions.

Key Responsibilities

• Perform the design and development of multi-layer package substrates (8+ layers) for advanced semiconductor devices.
• Perform package layout, routing, and stack-up planning using EDA tools (Mentor Graphics, Cadence Allegro, PLA).
• Ensure designs comply with substrate manufacturing rules (trace width/spacing, via design, impedance requirements).
• Incorporate assembly rules (die placement, bump/ball pitch, solder joint reliability, warpage control) into package designs.
• Develop and validate Flip Chip package designs, including bump assignment, redistribution layers (RDL), and underfill considerations.
• Collaborate with Signal Integrity (SI), Power Integrity (PI), and thermal analysis teams to ensure robust performance.
• Partner with substrate vendors and OSATs to verify design manufacturability, yield, and assembly feasibility.
• Provide on-site vendor support when required to resolve design and assembly issues.

Skills & Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Electronics, Materials Science, or related field.
• 5–8 years of hands-on experience in package design, with proven expertise in multi-layer (8+) substrate design.
• Proficiency with EDA tools: Mentor Graphics (Preferred), Cadence Allegro, PLA. (Mentor Graphics Xpedition / Cadence Allegro Package Designer)
• Strong knowledge of substrate manufacturing rules and assembly rules.
• Experience with Flip Chip package design methodologies.
• Familiarity with SI/PI/thermal considerations in advanced packages.
• Strong communication and collaboration skills for cross-functional and vendor engagement.
• Flexibility to travel and provide on-site vendor support as needed.