UST Hiring! Full Time Senior-Lead IC Package Design in Pulau Pinang - Ricebowl

Key Responsibilities

• Design and develop advanced IC package layouts for flip-chip, wire bond, FCBGA, FCCSP, and SiP packages.
• Perform package floorplanning, bump mapping, substrate routing, escape routing, and ball map design.
• Optimize package designs for signal integrity (SI), power integrity (PI), thermal performance, and manufacturability.
• Work closely with IC design, physical design, PCB, SI/PI, thermal, and manufacturing teams throughout the product development cycle.
• Support package feasibility studies, design reviews, and design rule checks (DRC).
• Drive package design verification and resolve package-related design issues.
• Collaborate with OSATs and substrate vendors during package development and qualification.
• Support package bring-up, characterization, and production ramp activities.
• Document design methodologies, best practices, and technical solutions.

Required Qualifications

• Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, Microelectronics, or a related field.
• 7+ years of experience in IC Package Design.
• Strong understanding of substrate design, bump planning, escape routing, stack-up design, and package assembly processes.
• Knowledge of signal integrity (SI), power integrity (PI), thermal analysis, and package reliability.