NXP Hiring! Full Time BGA WB Process Technician in WP Kuala Lumpur - Ricebowl

• Perform machine setup, conversion, and qualification for wire bond equipment.
• Monitor daily production performance and ensure compliance with process specifications.
• Support production activities to achieve output, quality, and delivery targets.
• Perform lot buy-off and process verification before production release.
• Monitor critical wire bond parameters and maintain process stability.
• Conduct routine process audits and inspections.
• Perform process characterization and parameter optimization activities.
• Analyze process data and identify trends affecting quality or yield.
• Troubleshoot wire bond defects and supports engineers for root cause analysis
• Support cost reduction and productivity enhancement initiatives.

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