Texas Instruments Hiring! Full Time Wire Bond - Die Attach Equipment Engineer (MES Project) in Federal Territory - Ricebowl

Change the world. Love your job.

Join TI as a specialized Equipment Engineer to drive the digital transformation of our Wire Bond and Die Attach lines. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Upon successful project completion, you will transition into a production role, utilizing your deep MES expertise to optimize equipment uptime and automation in a high-volume manufacturing environment.

Key Responsibilities:

• MES Implementation (Project Phase): Represent equipment engineering in the MES rollout. Define equipment-specific workflows, setup/recipe controls, qualification requirements, and equipment states.
• Integration & Data: Translate physical shop-floor requirements into digital process designs. Define data collection needs and equipment interlocks to ensure seamless hardware-to-software communication.
• Validation: Validate equipment integration scenarios and lead User Acceptance Testing (UAT) and deployment on the production floor.
• Sustaining (Post-Project Phase): Transition to a production role to manage equipment reliability, troubleshoot MES-related equipment issues, and leverage your implementation knowledge to drive continuous improvement in automation and uptime.

Minimum Requirements:

• Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree
• Strong hands-on semiconductor equipment experience in Wire Bond and/or Die Attach, with minimum 2 years of relevant experience

Preferred Qualifications:

• Equipment experience with ASM and KNS
• Experience working with MES platforms, whether Siemens OpCenter or another comparable MES product modeling or configuration
• Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and escalate early
• Experience on tool monitoring and interdiction software, and equipment maintenance and documentation
• Working knowledge of semiconductor manufacturing, and SPC techniques. Experienced with semiconductor cleanroom protocol and behaviors.
• Strong verbal and written communication skills
• Demonstrated strong analytical, critical thinking and problem solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery
• Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
• Demonstrated ability to build strong, influential relationship