- Prai Pulau Pinang Malaysia
Working Location
Job Description
Responsibilities
1.0 Job Responsibilities
• Oversee all SMT process-related activities, including engineering problem-solving and production efficiency improvement
• Provide SMT process work instructions to the manufacturing team, including WIs and process specifications.
• Prepare engineering analysis reports such as DFM, GR&R, CpK, and FMEA
• Design stencils (steel mesh) and pallets/fixtures for production
• Hands-on experience with Reflow, Wave Soldering, Underfill, Glob Top, Press Fit, and PCBA cleaning processes
• Drive process improvements to enhance yield and product quality, reduce scrap rate, and shorten cycle times.
• Execute and evaluate Engineering Changes (EC)
• Support introduction and transfer of new products, processes, fixtures, equipment, and technologies
• Provide accurate data, reports, and recommendations to management as required
• Prepare presentation materials for management reporting
• Understand customer requirements and work with the team to meet expectations
• Experience with DEK printers, ASM machines, AOI, X-ray, and Router equipment is preferred
• Conduct analysis and verification for customer complaints and product abnormalities
• Other additional work tasks or additional roles assigned by the superior
2.0 Job Requirements
• Bachelor’s degree or higher in Electronic Engineering, Mechanical Engineering, or related fields
• Ability to prepare, review, and maintain engineering documentation
• Proficient in Microsoft Office (Word, Excel, PowerPoint) and Minitab
• Able to work independently with minimal supervision
• Strong leadership skills and self-motivation to achieve excellent results
• Willing to travel approximately 5% as required
• Familiar with DFM principles, SMT IPC standards, ESD/MSD requirements, and Six Sigma tools and applications
• Strong expertise in SMT process parameter optimization, including stencil aperture design, printing parameter setup, and reflow profile tuning
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