Mnosys Hiring! Full Time Section Manager (Semiconductor Engineering) in WP Kuala Lumpur - Ricebowl

Section Manager (Semiconductor Engineering)

Location: Thailand (Relocation Package Provided)

Salary: Up to RM 13,000 equivalent per month (dependent on experience)

Why Join Us?

We are seeking an experienced Engineering Section Manager / Senior Manager to lead engineering teams, optimize advanced assembly processes, and manage high-impact projects.

For qualified candidates relocating to Thailand, we provide:

• One-way economy class airfare for your initial move

• 15 days of complimentary temporary accommodation upon arrival

• Relocation allowance equivalent to one month’s base salary (paid with your first payroll)

Key Responsibilities

• Team Leadership & Development: Supervise, mentor, and build a high-performing team of engineers, ensuring alignment with organizational goals and continuous technical skill development.

• Process & Technical Mastery: Leverage advanced knowledge in Die Attach, Flip Chip, SiP, Wire Bond, and Mold processes, equipment, and materials to drive yield and operational efficiency.

• Project Management & Execution: Oversee project planning, budgeting, and execution to deliver engineering initiatives strictly within scope, schedule, and budget.

• Quality & Compliance: Implement and maintain advanced quality tools—including FMEA, SPC, and control charts—across all engineering processes.

• Cross-Functional Collaboration: Partner closely with Operations and Quality teams to fulfill customer specifications, regulatory standards, and evolving global semiconductor market trends.

Requirements & Qualifications

• Education: Bachelor’s or Master’s Degree in Engineering (Mechatronics, Electrical/Electronic, Materials, Mechanical, or related fields).

• Experience: 7 to 10+ years of progressive engineering experience within the semiconductor industry, with a proven track record in leadership/management roles.

• Technical Expertise: Deep technical command of semiconductor assembly processes (Die Attach, Flip Chip, SiP, Wire Bond, Mold).

• Quality Tools: Demonstrated expertise in advanced quality methodology (FMEA, SPC, Control Charts).

• Certifications: PMP certification or equivalent formal project management training is highly preferred.

• Soft Skills: Excellent leadership, stakeholder management, performance management, and communication skills.

Remarks: Please note that Mnosys is a talent solutions provider. By submitting this application, you authorize Mnosys to retain, process, and store your personal data, resume, and application details. You explicitly consent to Mnosys sharing your profile and application materials with client companies for employment opportunities, particularly within the semiconductor, automation, and tech sectors.