- Tanjong Pagar Central Region (Singapore) Singapore
INTELLIPRO SINGAPORE PTE. LTD. Hiring! Full Time IC Packaging Engineer – Semiconductor in Central Region (Singapore), Earn up to SGD 12,500 - Ricebowl
IC Packaging Engineer – Semiconductor
INTELLIPRO SINGAPORE PTE. LTD.
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Job Description
Responsibilities
About the Role
We are seeking a dedicated
IC Packaging Engineer
to join our semiconductor engineering team. This role involves developing and optimizing
integrated circuit (IC) packaging solutions
, ensuring performance, reliability, and manufacturability for advanced semiconductor products. Fresh graduates with strong academic foundations in microelectronics or materials engineering are welcome to apply.
Key Responsibilities
Design and develop
IC packaging solutions
(wire bonding, flip-chip, WLP, BGA, CSP, etc.).
Collaborate with design, process, and test engineering teams to ensure package reliability and yield.
Perform
thermal, mechanical, and electrical analysis
of packaging designs.
Support
DFM (Design for Manufacturability)
and ensure compliance with industry standards.
Conduct failure analysis and propose improvements to packaging processes.
Prepare technical documentation and participate in design reviews.
Requirements
Bachelor’s Degree in Electrical/Electronic Engineering, Materials Science, or related discipline.
Knowledge of
semiconductor packaging technologies
and materials.
Familiarity with
EDA tools
for packaging design and simulation is preferred.
Strong analytical and problem-solving skills.
Added Advantage
Experience in
advanced packaging technologies
(e.g., 2.5D/3D IC, TSV, fan-out wafer-level packaging).
Exposure to
semiconductor manufacturing processes
and reliability testing.
What We Offer
Opportunity to work on cutting-edge semiconductor packaging projects.
Mentorship and training for fresh graduates to build a strong career foundation.
Competitive salary package and career development opportunities.
IntelliPro Group Inc. is one of the fastest growing IT services and HR solutions companies in Americas & APAC. We provide comprehensive IT services to help clients with IT Strategic Planning, Implementation, Deployment, IT Support on Artificial Intelligence, Big Data, Cloud Computing, Mobile Application Development, Data Mining and Business Intelligence, Enterprise Data Warehouse, and more.
Besides our established IT services, our new business now is quickly extending to one-stop HR Solution Services, including Oversea Branch Setup Consulting, Compensation & Benefits Policy Consulting, Payroll Management Service, Talent Recruiting, and Employer Branding to satisfy our clients’ fast business expansion requirement.
We have built our business on our company-wide commitment to continually overdeliver on the high expectations of our clients, employees, and business partners. The secret to our success is that our unified team works harder, faster, smarter, and more collaboratively than anyone else in the talent acquisition business. In addition to the immense talent and proprietary technology, IntelliPro Group is proud to offer continual professional development and extraordinary benefits to both consultants and full-time employees.
We are seeking a dedicated
IC Packaging Engineer
to join our semiconductor engineering team. This role involves developing and optimizing
integrated circuit (IC) packaging solutions
, ensuring performance, reliability, and manufacturability for advanced semiconductor products. Fresh graduates with strong academic foundations in microelectronics or materials engineering are welcome to apply.
Key Responsibilities
Design and develop
IC packaging solutions
(wire bonding, flip-chip, WLP, BGA, CSP, etc.).
Collaborate with design, process, and test engineering teams to ensure package reliability and yield.
Perform
thermal, mechanical, and electrical analysis
of packaging designs.
Support
DFM (Design for Manufacturability)
and ensure compliance with industry standards.
Conduct failure analysis and propose improvements to packaging processes.
Prepare technical documentation and participate in design reviews.
Requirements
Bachelor’s Degree in Electrical/Electronic Engineering, Materials Science, or related discipline.
Knowledge of
semiconductor packaging technologies
and materials.
Familiarity with
EDA tools
for packaging design and simulation is preferred.
Strong analytical and problem-solving skills.
Added Advantage
Experience in
advanced packaging technologies
(e.g., 2.5D/3D IC, TSV, fan-out wafer-level packaging).
Exposure to
semiconductor manufacturing processes
and reliability testing.
What We Offer
Opportunity to work on cutting-edge semiconductor packaging projects.
Mentorship and training for fresh graduates to build a strong career foundation.
Competitive salary package and career development opportunities.
IntelliPro Group Inc. is one of the fastest growing IT services and HR solutions companies in Americas & APAC. We provide comprehensive IT services to help clients with IT Strategic Planning, Implementation, Deployment, IT Support on Artificial Intelligence, Big Data, Cloud Computing, Mobile Application Development, Data Mining and Business Intelligence, Enterprise Data Warehouse, and more.
Besides our established IT services, our new business now is quickly extending to one-stop HR Solution Services, including Oversea Branch Setup Consulting, Compensation & Benefits Policy Consulting, Payroll Management Service, Talent Recruiting, and Employer Branding to satisfy our clients’ fast business expansion requirement.
We have built our business on our company-wide commitment to continually overdeliver on the high expectations of our clients, employees, and business partners. The secret to our success is that our unified team works harder, faster, smarter, and more collaboratively than anyone else in the talent acquisition business. In addition to the immense talent and proprietary technology, IntelliPro Group is proud to offer continual professional development and extraordinary benefits to both consultants and full-time employees.
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