Sandisk Hiring! Full Time Senior Process Engineer in WP Kuala Lumpur - Ricebowl

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Own and support the Flip Chip Attach (FCA) process to achieve quality, yield, cost, reliability, and productivity targets.
• Provide technical support to Advanced Process Engineering in delivering process and equipment solutions that meet operational and development requirements.
• Monitor and maintain assembly yield and test yield performance related to the FCA process in alignment with departmental KPIs.
• Develop and set up new Flip Chip Attach processes, including recipe setup and optimization, process window studies, Design of Experiments (DOE), and Corner limit validations.
• Drive and establish Golden Recipe configurations for new package qualifications.
• Maintain and standardize FCA recipe templates in accordance with Positrol log guidelines.
• Execute process qualifications to meet Critical-to-Quality (CTQ) requirements, CPK targets, Throughput (UPH) goals, Yield/cost objectives, and Risk assessment standards.
• Lead the introduction of new products, devices, and package processes into production while ensuring effective process transfer and handover to manufacturing.
• Support qualification activities for new materials, tools, and technologies.
• Perform troubleshooting and drive continuous improvement using structured problem-solving methodologies such as 5M + 1E, 5 Whys, DMAIC, and 8D.
• Develop and lead SiP (System in Package) assembly and IC packaging material and process development programs to meet quality, reliability, cost, yield, productivity, and manufacturing requirements.
• Lead new package and SMT/Flip Chip/Underfill qualification programs.
• Plan and conduct experiments to fully characterize materials and processes throughout pathfinding, development, and ramp stages.
• Develop solutions to improve quality, reliability, cost, yield, process stability/capability, and productivity using statistical knowledge and problem-solving tools.
• Establish process control systems and support process transfer to high-volume manufacturing and new factory start-up activities.
• Maintain product quality while developing and introducing package cost reduction programs.
• Collaborate closely with Production, Quality, Equipment Engineering, Factory Automation, IT, NPI teams, and suppliers/vendors.
• Coordinate and lead continuous improvement projects within the FC team.
• Develop and maintain process documentation, including Standard Operating Procedures (SOPs) and Work Instructions (WIs).
• Carry out additional responsibilities and assignments as delegated by management.
• Lead 1-LOD initiatives including machine fingerprinting activity and driving prevention excursion management.

Required:

• Bachelor’s Degree or higher in Electrical Engineering, Mechanical Engineering, Physics, or related Engineering/Science disciplines.
• Minimum 8–10 years of experience in Flip Chip Attach process engineering, or 6 years for PhD holders.
• Experience in running thin die products for flip chip die-level assembly.
• Relevant engineering experience within the semiconductor industry is required.
• Strong hands-on experience with BESI Datacon, FUJI NXT, DEK NeoHorizon, and Kohyoung & PARMI SPI/AOI machines.
• Strong knowledge of semiconductor assembly processes and manufacturing operations.
• Strong machine programming, process troubleshooting, and production support capability.
• Strong analytical thinking and engineering problem-solving skills.
• Demonstrated capability in process optimization and quality improvement.
• Capable of leading a group of engineers to solve quality issues and improvement projects.

Preferred:

• Knowledge or experience in FMEA, SPC, 8D Problem Solving, Six Sigma, DOE, Minitab, and JMP.
• AI/ML experience related to manufacturing or process optimization is an added advantage.
• Experience in handling customer requirements, especially for automotive customers, is an added advantage.
• Proficiency in statistical data analysis and process simulation software.
• Demonstrated experience in pathfinding and developing new SMT/FCA/UF materials with vendors and qualification methodologies.
• Strong capability in failure analysis and root cause investigation using EDX, FTIR, Shadow Moire, simulation reports, and metrology data.
• Strong project management, planning, and organizational skills.
• Self-motivated, proactive, and capable of working independently with minimal supervision.
• Strong sense of urgency, accountability, and quality awareness.
• Excellent communication, teamwork, and interpersonal skills.
• Strong attention to detail and commitment to achieving goals.
• Ability to adapt and work effectively in a fast-paced manufacturing environment.