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Executive Compass Hiring! Full Time Plating Manager- Senior Manager in Kedah, Earn up to MYR 23,000 - Ricebowl

Plating Manager- Senior Manager

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Working Location

  • Kulim Kedah Malaysia

Job Description

Responsibilities

Lead, direct, and optimize the wet chemistry and plating manufacturing operations. This role is responsible for driving production yields, managing capital expenditure projects, and leading a high-performing engineering and technical team to meet stringent technology roadmaps and high-volume manufacturing demands.

Responsibilities:

1. Operations & Yield Management

  • Drive KPIs: Maximize line throughput, minimize scrap rates, and maintain world-class First-Time-Right (FTR) quality yields.
  • Process Optimization: Oversee the performance of automated horizontal and vertical continuous plating lines.
  • Statistical Controls: Implement rigorous Statistical Process Control (SPC) and Design of Experiments (DOE) to minimize process variations.
  • Troubleshooting: Serve as the final technical authority for resolving complex plating defects (e.g., micro-voids, thickness non-uniformity, delamination).

2. Strategic Leadership & Capital Projects (CAPEX)

  • Line Expansion: Lead the installation, qualification, and commissioning of new, advanced plating equipment lines.
  • Vendor Management: Partner with global chemical and equipment suppliers to evaluate new technologies and optimize chemical consumption costs.
  • Cross-Functional Collaboration: Work closely with the R&D and New Product Introduction (NPI) teams to transition advanced plating processes into high-volume manufacturing.

3. Team Leadership & People Management

  • Talent Development: Manage and mentor a multi-tiered team of plating engineers, laboratory technicians, and production shift supervisors.
  • Culture: Foster a data-driven, continuous improvement culture using Lean Six Sigma methodologies.

Requirements:

  • Education: Bachelor’s, Master’s, or Ph.D. in Chemical Engineering, Chemistry, Materials Science, or a related technical discipline.
  • Experience:
  • Minimum 10+ years of engineering experience in the semiconductor, IC substrate, or advanced PCB industry.
  • Minimum 5+ years in a managerial or senior leadership role directly overseeing wet chemical and plating processes.
  • Deep technical mastery of Electroless Copper Plating, Copper Electroplating (ECD), Desmear, and micro-via filling processes.
  • Expert knowledge of chemical bath analysis, automated dosing systems, and analytical lab tracking (e.g., Cyclic Voltammetric Stripping - CVS).

Pay: RM12,000.00 - RM23,000.00 per month

Application Question(s):

  • Which type of plating experience do you have? Can you list out?

Education:

  • Bachelor's (Preferred)

Experience:

  • Plating: 10 years (Preferred)
  • Managerial position: 5 years (Preferred)

Work Location: In person

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