- Pasir Ris East Region (Singapore) Singapore
SILICON BOX PTE. LTD. Hiring! Full Time Associate Engineer, Process in East Region (Singapore), Earn up to SGD 4,800 - Ricebowl
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Job Description
Responsibilities
Position Summary
The
Process Associate Engineer
willbe responsible to support the organisation’s Product Development and NewProduct Introduction activities reliably and efficiently. Candidates withrelated experience in Semiconductor and LCD processes are encouraged to applyfor this position.
Responsibilities
Assist Engineers in:
Process recipe setup and qualification for production
Process monitoring and improvement.
Troubleshoot process-related issue.
Perform lots on hold and disposition
Engineering data collection
Other ad-hoc activities.
Support production line by:
Ensuring that process integrity for machines is in place forproduction.
Maintaining good housekeeping in the production area,
Co-ordinating with line operators/supervisors to ensure thatwork is carried out efficiently to meet module objectives and thatSOPs are strictly followed.
Requirements
Diploma in Electrical/ Electronics/ Mechatronics/Mechanical/ Microelectronics Engineering or similar disciplines
No work experience required; training will be provided
Prior experience in the following areas in a semiconductor manufacturing environment would be advantageous:
Die preparation/ recon (backgrind, dicing, laser-grooving, pick and place, molding) processes
PVD (sputtering), chemical wet etching/ cleaning, lithography processes
Backend (ball mounting, ball drop, reflow, laser marking, package sawing, TnR) processes
Prior experience in manufacturing documentation of SPC, WI,SOP, FMEA, etc would be advantageous
Able to work under various shift patterns. Selected candidates will start with normal office hours, and eventually transition to 12-hour shifts
Silicon Box Pte Ltd is one of Asia’s fastest growing technology unicorn, at the forefront of semiconductors integration, emerging from the new horizon of Chiplets integration trends in the semiconductor industry, driven by the needs of "dis-integration", benefits of faster time-to-market and lower cost of new device design.
We provide services of semiconductor design of Chiplets at the leading edge of semiconductor device integration scheme with the next generation of advanced packaging manufacturing technologies.
The
Process Associate Engineer
willbe responsible to support the organisation’s Product Development and NewProduct Introduction activities reliably and efficiently. Candidates withrelated experience in Semiconductor and LCD processes are encouraged to applyfor this position.
Responsibilities
Assist Engineers in:
Process recipe setup and qualification for production
Process monitoring and improvement.
Troubleshoot process-related issue.
Perform lots on hold and disposition
Engineering data collection
Other ad-hoc activities.
Support production line by:
Ensuring that process integrity for machines is in place forproduction.
Maintaining good housekeeping in the production area,
Co-ordinating with line operators/supervisors to ensure thatwork is carried out efficiently to meet module objectives and thatSOPs are strictly followed.
Requirements
Diploma in Electrical/ Electronics/ Mechatronics/Mechanical/ Microelectronics Engineering or similar disciplines
No work experience required; training will be provided
Prior experience in the following areas in a semiconductor manufacturing environment would be advantageous:
Die preparation/ recon (backgrind, dicing, laser-grooving, pick and place, molding) processes
PVD (sputtering), chemical wet etching/ cleaning, lithography processes
Backend (ball mounting, ball drop, reflow, laser marking, package sawing, TnR) processes
Prior experience in manufacturing documentation of SPC, WI,SOP, FMEA, etc would be advantageous
Able to work under various shift patterns. Selected candidates will start with normal office hours, and eventually transition to 12-hour shifts
Silicon Box Pte Ltd is one of Asia’s fastest growing technology unicorn, at the forefront of semiconductors integration, emerging from the new horizon of Chiplets integration trends in the semiconductor industry, driven by the needs of "dis-integration", benefits of faster time-to-market and lower cost of new device design.
We provide services of semiconductor design of Chiplets at the leading edge of semiconductor device integration scheme with the next generation of advanced packaging manufacturing technologies.
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