- 6 CHANGI NORTH STREET 2 East Region (Singapore) Singapore

Working Location
Job Description
Responsibilities
Job Objectives
Support the Production team on box shipment to meet production schedules.
Lead the team for the testing set-ups and capabilities aligned to the company’s technology and product roadmap, and to integrate them with in-house manufacturing capabilities.
Duties and Responsibilities
Able to do setups for test work stations, preferably for Optoelectronics and Laser chips testing.
Able to do simple programming to derive data and analyze test data.
In-charge of the generating the Out-going report (OGR) for both ILM box and LSM.
Generate test reports with measurement results and detailed analyses in a timely manner.
Manage SPC, Soldering Temperature checks and OSA calibration.
Responsible for updating the work instruction, SOP and any other documents within the ILM scope
Need to perform minor troubleshooting and work with Product Engineering on minor improvement works.
Managed and record box production yield. Resolve the issues through root cause analysis
Must be able to solder small components on PCB.
Ability to do simple PCB routing and troubleshooting
Minimum Education
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