ASE SINGAPORE PTE. LTD. Hiring! Full Time NPI Engineer - Test Process (WLCSP) in North Region (Singapore), Earn up to SGD 4,500 - Ricebowl

Responsibilities

• Responsible for set-up and optimization of new device qualification, engineering lot processing, process data gathering and reporting
• Monitor and improve device yield performance and process SPC charts
• Investigate and troubleshoot production downtime and quality issues to provide lot disposition on outlier lots
• Perform engineering report and documentation such as 8D, DMAIC, FMEA, CP, Process Specification, Work Instructions, etc
• Implement continuous improvement program (CIP) to support yield and cost improvement, including developing systems for workflow management
• Facilitate training of manufacturing personnel on operating procedures and process specification
• Work closely with inter-department to improve process and equipment performance and capability
• Coordinate and communicate with customers for any process engineering related matters
• Setup systems and NPI requirements, handles qualifications and engineering activities

Requirements

• Diploma / Degree in any Engineering Discipline
• Working experience in semiconductor assembly manufacturing or process engineering and pre-assembly processes (Backgrind, Laser Marking, Laser Groove, Wafer Dicing) is an advantage
• Knowledge in SPC, DOE, FMEA, OCAP, Control Plan, WI and Process Specification
• Clear and effective communication with customers, suppliers and cross department
• Able to multi-task and support ad-hoc projects in process and equipment related activities
• Entry level candidates are welcome to apply

The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader geared towards meeting the industry's ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test, program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and design manufacturing services.