jobs in SILICON BOX PTE. LTD.

SILICON BOX PTE. LTD. Hiring! Full Time Engineer, Product Development in East Region (Singapore), Earn up to SGD 9,000 - Ricebowl

Engineer, Product Development

SILICON BOX PTE. LTD.

SGD5,000 - SGD9,000 Per Month

Pasir Ris, East Region (Singapore)

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Working Location

  • Pasir Ris East Region (Singapore) Singapore

Job Description

Responsibilities

Position Summary

The Engineer, Product Development is responsible for the development and establishment of new product and transfer process into production.

Responsibilities

  • New product development as requested by customer and internal roadmap, and transfer into production
  • New material, process & machine development and qualification, and transfer into production
  • Troubleshoot process issues and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
  • Establish, review and update specifications, workflow, quality and safety related documentation for new products and transfer to production line.
  • Coordinate and liaise with vendor/suppliers on process issue or quality issue.
  • Support customer NPI activities and internal engineering activities.
  • Handle and manage customer audits and 8D reports.
  • Any other ad-hoc duties as assigned.

Requirements

  • Bachelor’s Degree in Materials Science, Microelectronics, Electrical, Chemical engineering or similar disciplines
  • At least 3 years of experience in product development or NPI work in area of Wafer-level Fanout packaging production line or LCD/FPD production line, focusing on processes such as:
  • Die Preparation/ Recon
  • Lithography
  • Knowledge in process engineering, process control engineering and yield enhancement
  • Experience in DOE, FMEA, and 8D reports

Silicon Box Pte Ltd is one of Asia’s fastest growing technology unicorn, at the forefront of semiconductors integration, emerging from the new horizon of Chiplets integration trends in the semiconductor industry, driven by the needs of "dis-integration", benefits of faster time-to-market and lower cost of new device design.


We provide services of semiconductor design of Chiplets at the leading edge of semiconductor device integration scheme with the next generation of advanced packaging manufacturing technologies.

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