STATS CHIPPAC MANAGEMENT PTE. LTD. Hiring! Full Time R - D Engineer – C-A and TCB in North Region (Singapore), Earn up to SGD 6,500 - Ricebowl

About the role

To lead the development, evaluation, and optimization of advanced Thermal Compression (TC) bonding and chip attach processes and equipment for next-generation advanced packaging technologies (e.g., chiplet integration, HBM, 2.5D/3D architectures). To establish robust bonding recipes, ensure precise co-planarity and alignment control, and successfully drive TC bonder tools from R&D concept validation to customer/internal qualification.

Key responsibilities

• Advanced TC Bonding Process development for CoWoS PKG product family and CPO

• Tool & Hardware Development / Qualification

• Warpage & Co-planarity Control

• Failure Analysis & Reliability Enhancement

• Customer Development & Technology Transfer

• Lead assigned projects

• Yield Improvement & Yield Failure Analysis (FA)

About you

• Bachelor's degree or higher in engineering or science (e.g., Material Science, Chemistry, chemical Engineering, Electronics, Advanced Materials, etc.)

• R&D or mass production experience of at least three years in Thermal Compression Bonding (TCB), flip-chip assembly, or micro-bump bonding processes

• Proven experience in driving customer development programs (e.g., JDP, customer qualification, technical evaluations) and managing customer requirements

• Fundamental understanding of advanced semiconductor packaging processes, thermal-mechanical bonding behavior, and warpage control

• Strong skills in experimental design (DoE), failure analysis (FA), and technical data reporting

• Ability to prepare technical documents and deliver presentations to internal and external stakeholders

• Proficiency in reading and writing technical documents in English