United Microelectronics Corporation (UMC) Hiring! Full Time Technology Development Advanced Packaging Engineer in - Ricebowl

We are looking for a skilled OSAT & Advanced Packaging Engineer to drive Advanced packaging technology development. This role will focus on advanced packaging technologies, ensuring high-quality, cost-effective, and timely product delivery while collaborating with cross-functional team.

Job Responsibilities:

• Work on 2.5D/3D Advanced packaging platform technologies.
• Develop chip form (chip to wafer stacking), wafer to wafer 2.5/3D stacking, organic interposer, bumping, organic RDL processes and silicon interconnect.
• Collaborate with internal R&D and OSAT partners to drive Heterogeneous Integration.
• New advanced packaging process verification and qualification.
• Customer engagement and new product verification

Requirements:

• Knowledge of chip form (chip to wafer stacking), organic interposer, bumping, organic RDL (Redistribution Layer), and Silicon interconnect technologies are plus.
• Experienced in 2.5D and 3DIC wafer stacking process development are plus.
• Skill on FMEA, control plan, DOE (design of experiment) and problem solving.
• Good communication, self-motived and avid learner

Qualification

• At least bachelor's degree in electronics/electrical/physics/Materials engineering or other relevant fields.
• At least 3 years working experience in in advanced packaging OSAT R&D/Integration/Process engineer or other relevant fields.
• Proficient English oral and writing skill.