- Bayan Lepas Pulau Pinang Malaysia
Working Location
Job Description
Responsibilities
Staff Industrial Engineer
Role Overview
We are seeking a seasoned Staff Industrial Engineer with 15+ years of experience to lead wafer fab and cleanroom capacity optimization, layout design, and operational strategy. You will program-manage complex factory expansion and start-up initiatives from initial concept to tool hook-up. This role merges advanced semiconductor capacity modeling with technical costing, driving capital expenditure (CapEx) strategies for new business. This is a senior-level, local individual contributor role with high organizational visibility. This position is based at ASE Semiconductor Penang, formerly known as Analog Devices (ADI).
Key Responsibilities
Semiconductor Cleanroom & Floor Planning
· Program-manage massive wafer fab floor planning projects and sub-fab layout integrations.
· Design layouts for advanced cleanrooms (ISO Class 3 to Class 6) optimized for laminar airflow, vibe-sensitive tools, and ultra-pure utility routing.
· Optimize footprints for automated material handling systems (AMHS), stockers, and overhead hoist transport (OHT).
· Direct cross-functional teams include facilities, equipment engineering, and sub-contractors to execute seamless tool start-ups.
Capacity Modeling & Factory Simulation
· Build dynamic models for semiconductor equipment footprint, labor headcount, and tool capacity constraints.
· Analyze bottleneck tools (e.g., Lithography, Etch, Diffusion) and optimize Overall Equipment Effectiveness (OEE).
· Simulate wafer flows to predict queue times, cycle time multiples, and raw wafer starts per week (WSPW) under shifting product mixes.
New Business Costing & CapEx Strategy
· Engineer costing structures for new customer engagement models, technology nodes, and specialized wafer variants.
· Forecast capital investment requirements for tool upgrades, specialized cleanroom build-outs, and footprint modifications.
· Calculate cost of ownership (COO) for new tools to ensure alignment with corporate gross margin targets.
Qualifications & Skills
Education
· Degree: Bachelor’s or Master’s degree in Industrial Engineering, Manufacturing Engineering, Material Science, or any STEM discipline.
Required Experience & Skills
· Experience: 15+ years of hands-on industrial engineering experience within a semiconductor manufacturing (Fab/Foundry) or advanced packaging environment. [1]
· Technical Skills: Working knowledge of AutoCAD and FlexSim (or equivalent simulation software) is a distinct advantage.
· Industry Domain: Deep understanding of semiconductor process steps, automated material handling, cleanroom standards, and tool-utility hook-up procedures.
· Business Acumen: Demonstrated mastery of factory costing, tool COO models, and multi-million dollar CapEx management.
Additional Position Details
· Structure: Individual contributor role with no direct reports, requiring strong matrix leadership skills to influence cross-functional teams.
· Travel: Based locally, with occasional short-duration local or global travel required depending on specific project milestones and vendor evaluations.
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