SILICON BOX PTE. LTD. Hiring! Full Time Engineer, Process in East Region (Singapore), Earn up to SGD 7,000 - Ricebowl

Job Description

• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line.
• Establish, review and update specifications, workflow, quality and safety related documentation for production line.
• Trouble shoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
• Process sustaining and control through SPC and periodic defect Pareto Analysis.
• Lead and drive process control measures such as SPC, FDC/KPC and RCA towards zero defects.
• Lead and drive continuous improvement activities in area of quality, productivity, cycle time, cost and process control automation.
• Review and update FMEA, Control plan OCAP with cross-functional teams.
• Coordinate and liaise with vendor/suppliers on process issue or quality issue.
• Support customer NPI activities and internal engineering activities.
• New material, process & machine development and qualification.
• Handle and manage customer audits and 8D reports.
• Provide disposition for engineering and production lots.
• Conduct process characterization and qualification to establish process baseline.
• Any other ad-hoc duties as assigned.

Requirements:

• Bachelor’s Degree in Chemical, Materials Science, Microelectronics, Mechanical Engineering or relevant engineering degrees.
• At least 3-years hands-on process experience in area of in the Wafer-level Fanout packaging production line or LCD/FPD production line in either Wet, PVD, Lithography or AOI.
• Knowledge in process engineering, process control engineering and yield enhancement.
• Experience in SPC, DOE, FEMA, and 8D reports

Silicon Box Pte Ltd is one of Asia’s fastest growing technology unicorn, at the forefront of semiconductors integration, emerging from the new horizon of Chiplets integration trends in the semiconductor industry, driven by the needs of "dis-integration", benefits of faster time-to-market and lower cost of new device design.

We provide services of semiconductor design of Chiplets at the leading edge of semiconductor device integration scheme with the next generation of advanced packaging manufacturing technologies.