VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD. Hiring! Full Time Engineer (Bond Equipment) in East Region (Singapore), Earn up to SGD 4,100 - Ricebowl

Job Description:

• Serve as the Equipment Owner for wafer bonding equipment within the Photo Department, ensuring optimal tool performance, reliability, and process capability.
• Evaluate, select, and justify equipment, upgrades, and solutions that are cost-effective and aligned with photonics manufacturing requirements.
• Oversee installation, qualification, modification, upgrades, and maintenance of wafer bonders, Gemini bonders, and related production equipment.
• Partner with equipment vendors to resolve technical issues and manage vendor performance to meet or exceed equipment KPIs, including MTTR, MTBF, OEE, and uptime targets.
• Establish and execute projects focused on capacity expansion, yield improvement, defect reduction, cost savings, and equipment optimization.
• Review and analyze SPC data, equipment performance metrics, and Fault Detection & Classification (FDC) data to identify trends and implement effective corrective actions.
• Provide technical support to manufacturing, maintenance, and process engineering teams to ensure stable production operations.
• Develop, maintain, and continuously improve preventive and predictive maintenance procedures, schedules, and documentation.
• Conduct technical training for operators, technicians, and engineers on equipment operation, maintenance, troubleshooting, and best practices.
• Mentor and coach shift engineers in systematic hardware troubleshooting, root cause analysis, and the development of troubleshooting guides, OCAPs, and lesson-learned documentation.
• Provide technical support to manufacturing, maintenance, and process engineering teams to ensure stable production operations.
• Develop, maintain, and continuously improve preventive and predictive maintenance procedures, schedules, and documentation.

Job Requirements:

• Bachelor's Degree in Electrical, Electronics, Mechanical, Mechatronics, Microelectronics Engineering, or related Engineering discipline.
• Minimum 2 years of semiconductor equipment or process engineering experience, preferably in Lithography/Photo, Advanced Packaging, or Wafer Bonding operations.
• Hands-on experience with Wafer Bonders, Gemini Bonders, SAM Coat equipment.
• Strong knowledge of equipment troubleshooting, process optimization, equipment qualification, and production support in a high-volume manufacturing environment.
• Experience in developing, implementing, and sustaining preventive and predictive maintenance strategies to maximize equipment uptime and performance.
• Ability to execute equipment upgrades, hardware modifications, and continuous improvement projects to enhance reliability, capability, and operational efficiency.
• Strong analytical and logical thinking skills with a proven track record of driving effective problem resolution.
• Excellent communication, interpersonal, and stakeholder management skills.
• Willing to work Normal Shift, Swing Shift, or 12-hour rotating shift when required.