Sandisk Hiring! Full Time Engineer, Backend Assembly Equipment Maintenance - Preventative Maintenance in WP Kuala Lumpur - Ricebowl

Provide technical leadership and engineering support for Backend Assembly manufacturing equipment to ensure high reliability, availability, and operational performance. Responsible for equipment troubleshooting, maintenance optimization, continuous improvement, automation initiatives, and new equipment deployment to support manufacturing objectives.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Support and maintain Backend Assembly manufacturing equipment to achieve reliability, uptime, quality, and productivity targets.
• Perform equipment troubleshooting, root cause analysis, and implementation of corrective and preventive actions.
• Drive continuous improvement projects to improve equipment performance, reduce downtime, and increase operational efficiency.
• Develop and optimize preventive and predictive maintenance strategies.
• Lead equipment qualification, installation, upgrades, and new equipment introduction activities.
• Monitor and analyze equipment performance indicators and provide recommendations for improvement.
• Collaborate with Manufacturing, Process Engineering, Quality, Facilities, and other cross-functional teams to resolve technical issues and support production requirements.
• Develop automation solutions and engineering improvements to enhance manufacturing effectiveness.
• Create and maintain technical documentation, maintenance procedures, troubleshooting guides, and engineering reports.
• Ensure compliance with safety, quality, environmental, and operational standards.
• Support business continuity and recovery activities for critical equipment issues.

REQUIRED:

• Bachelor's Degree in Electrical Engineering, Mechanical Engineering, Mechatronics Engineering, Manufacturing Engineering, or related engineering discipline.
• Minimum 5–8 years of experience in Backend Assembly Equipment Engineering, Equipment Maintenance, Manufacturing Engineering, or a related technical field (Package Saw, AOI, Solder Ball Attach, Laser Marking, Curing Oven, Reflow Oven, etc).
• Strong knowledge of semiconductor or high-volume manufacturing equipment operation, maintenance, and troubleshooting.

PREFERRED:

• Experience with equipment reliability, preventive maintenance, predictive maintenance, and equipment performance optimization.
• Proficient in problem-solving methodologies such as RCA, 8D, 5-Why, FMEA, and CAPA.
• Experience supporting equipment qualification, process improvement, and new equipment introduction projects.

SKILLS:

• Knowledge of automation, controls, data analysis, and manufacturing performance metrics is preferred.
• Strong analytical, technical, communication, and stakeholder management skills.
• Ability to work independently and manage multiple priorities in a fast-paced manufacturing environment.
• Demonstrated commitment to safety, quality, continuous improvement, and operational excellence.