Full Time DFM Engineer Jobs, in LUMILENS - Ricebowl

About Lumilens

We’re a super-fast growth transceiver maker in the industry! At Lumilens, we’re developing high-speed photonics products purpose-built to power the future of AI infrastructure and high-performance computing. Lumilens is unlocking a new era of computing - faster, cooler, and massively more efficient.

Position Overview

We are seeking a hands-on DFM Engineer to serve as the primary engineering interface between Lumilens’ hardware design teams, package manufacturing teams and worldwide suppliers.

This role focuses on DFM/DFR of optical transceiver manufacturing process, from SMT, Die Attach, Wire Bonding, Flip Chip, TCB Bonding, Underfill, FAU Active Alignment, Mechanical Assembly, to Reliability Tests. The candidate must have solid hands-on experience in transceiver assembly process, very familiar with various packaging materials and equipment. Strong skills in data review, report summary and communications. Engage with substrate design team, optical design team, chip design team, production line, NPI line and component/material suppliers during early development phase to provide DFM based on different POC designs.

This position is ideal for an engineer who combines deep Material/Chemistry/Mechanical/Electrical/Optical knowledge with a passion for manufacturing process excellence and cross-functional execution at a global scale.

Key Responsibilities

• Lead DFM/DFR of various transceiver designs, from pluggable, NPO to CPO.
• Capability assessment and risk analysis of each process, machine and material.
• Engage with packaging production teams during the early process development, collect data and make summaries for decision making on time.

Required qualifications

• B.S. or M.S. in Material, Chemistry or Mechanical Engineering.
• 10+ years of working experience in transceiver assembly process development or similar products, with in-depth knowledge in material (solder, epoxy, glass, ceramic, etc.), equipment (SMT, die bonder, active aligner, TCB bonding, etc.), component (FR4, PIC chip, EIC chip, FAU, SMD, etc.). Must be very familiar with the typical process capabilities.
• Familiar with Cadence, Solidworks and JMP.
• Familiar with FMEA, Control Plan, SPC, 8D, etc.
• Fluent in English to communicate with stakeholders globally.