- Yishun North Region (Singapore) Singapore
STATS ChipPAC Pte. Ltd. Hiring! Full Time Senior- Associate in North Region (Singapore), Earn up to SGD 5,500 - Ricebowl
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Job Description
Responsibilities
Manage monthly and weekly demand forecasts, including forecast commitment and capacity allocation to Account Management (AM) and Sales teams across all business units.
Lead monthly capacity review meetings with Industrial Engineering (IE), Customer Service (CS), Planning, Purchasing, and Operations teams throughout the forecast cycle to ensure alignment between demand and available capacity.
Collaborate closely with AM, Sales, IE, Purchasing, and Operations teams to validate forecast commitments and identify potential capacity or material constraints. Escalate critical constraints to management for timely resolution and decision-making.
Develop strategic solutions to fulfil customer demand requirements by optimizing capacity allocation, balancing operational constraints, and supporting the achievement of company revenue targets.
Analyze monthly and weekly forecast revenue and prepare regular reports for management review, highlighting key trends, gaps, risks, and opportunities.
Prepare and maintain forecast and die-attainment reports to support management review and performance monitoring.
Prepare monthly forecast commitment reports based on specific customer reporting requirements and prescribed formats.
Manage and respond to customer ad-hoc requirements by conducting offline assessments in collaboration with IE, Operations, and Purchasing teams to determine feasibility and provide timely solutions.
Required Experience and Qualifications (Required knowledge, skills and experience---however acquired):
Degree in any disciplines or Diploma with minimum 1 years’ working experience in semiconductor field.
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
Lead monthly capacity review meetings with Industrial Engineering (IE), Customer Service (CS), Planning, Purchasing, and Operations teams throughout the forecast cycle to ensure alignment between demand and available capacity.
Collaborate closely with AM, Sales, IE, Purchasing, and Operations teams to validate forecast commitments and identify potential capacity or material constraints. Escalate critical constraints to management for timely resolution and decision-making.
Develop strategic solutions to fulfil customer demand requirements by optimizing capacity allocation, balancing operational constraints, and supporting the achievement of company revenue targets.
Analyze monthly and weekly forecast revenue and prepare regular reports for management review, highlighting key trends, gaps, risks, and opportunities.
Prepare and maintain forecast and die-attainment reports to support management review and performance monitoring.
Prepare monthly forecast commitment reports based on specific customer reporting requirements and prescribed formats.
Manage and respond to customer ad-hoc requirements by conducting offline assessments in collaboration with IE, Operations, and Purchasing teams to determine feasibility and provide timely solutions.
Required Experience and Qualifications (Required knowledge, skills and experience---however acquired):
Degree in any disciplines or Diploma with minimum 1 years’ working experience in semiconductor field.
Join a leader in the industry!
STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.
Join us and expand your world.
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