About Mechatronic Systemtechnik Asia Sdn Bhd

mechatronic's fully automated handling systems are used for non-contact transport of wafers. For this, various procedures and equipment have been developed – such as the Bernoulli and also the vacuum technology – which are applied individually according to customer demands. We are the world's only company able to handle thin and ultra-thin wafers both on the chip side and on the rear of the wafer.

Thanks to our leading-edge technology – which is being increased continuously by new developments – we can provide handling solutions for thin and ultra-thin wafers that are matched precisely to our customers' need.