About Carsem (M) Sdn Bhd

Welcome to the Career Page of Carsem (M) Sdn Bhd!

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, offering one of the widest range package & test portfolios in the world. Founded in 1972, we have earned a reputation as one of the most experienced and largest companies in our industry, with a strong focus on unit volume production. With over 6,000 employees, we ship in excess of 100 million units each week, and more than 65% of this volume is shipped as fully tested product. Carsem is proud to be a member of the Hong Leong Group, one of South East Asia's most successful corporations, which recognizes semiconductors as a core business.

Carsem operates three high-technology factories. Two of these factories are located in Ipoh, Malaysia, and a new third factory is situated in Suzhou, China. The two Malaysian factories, Carsem - M Site and Carsem - S Site, are strategically located just 10 miles (16Km) apart. Ipoh is conveniently accessible, being a 90-minute drive from Penang and 2.5 hours from Kuala Lumpur.

Our factories are well-equipped with extensive R&D and failure analysis staff and incorporate highly sophisticated, state-of-the-art automated equipment to ensure the production of quality products that meet the stringent standards of the automotive, telecom, computer, and consumer goods industries. Both factories maintain world-class quality standards, having achieved ISO/TS *6949, ISO-9001, and ISO-*4001 certifications, and they comply with the Sony Green Partner Program. In addition, we have a global network of sales and technical support offices to provide efficient services to our customers.

The Carsem-Suzhou Ltd. factory in China is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. Covering 172K sq. ft. (16K sq. m.) and situated on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park, the factory is well-equipped and has been operational since January 2004. It serves as a key facility for the manufacture of the MLP (Micro Leadframe Package) Quad and Dual.

Carsem offers a wide range of product groups assembled at both M Site and S Site, catering to various semiconductor needs, including MLP MICRO I.C., PDIP, PLCC, SOIC, MSOP, QSOP, MICRO SOT, SOT66x, TSOT, TO92, SC 70, POWER TO220, DDPAK, SOT223, MLP QUAD, DUAL ARRAY, SSBGA, SSLGA, FTBGA, CBGA, I.C. PDIP, PLCC, SOIC, QSOP, SSOP, TSSOP, QFP, MQFP, LQFP, TQFP, and SiP System in Package.

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World."

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice."

Carsem's commitment is to provide products and services of the highest quality through a "ZERO DEFECTS TODAY!" preventive Quality culture. Our employees act with honesty, sincerity, and teamwork, continuously striving for improvements in quality, productivity, delivery, services, and cost to remain competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

Join our team and be a part of our dynamic and forward-looking organization. At Carsem, we value employee development and strive for excellence in everything we do. Together, let's build a successful and rewarding future in the semiconductor industry.