49 Semiconductor Packaging 工作 | 马来西亚 | 职位空缺 | September 2026 | Ricebowl 铁饭网

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显示49个工作的结果 "semiconductor packaging"

不要错过任何 Semiconductor Packaging 的新工作机会

Assembly Die Bond Process Engineer Assembly Die Bond Process Engineer

NXP Semiconductors

Undisclosed

KL City

Posted

3 days ago

Senior Advanced Packaging Engineer (Taiwan) Senior Advanced Packaging Engineer (Taiwan)

Eridu AI

Undisclosed

台灣

Posted

4 days ago

Senior Advanced Packaging Engineer (Taiwan) Senior Advanced Packaging Engineer (Taiwan)

Eridu AI

Undisclosed

台灣

Posted

4 days ago

UP$24-HR IMMEDIATE HIRE - NEAR MRT SEMICONDUCTOR CHIPS PACKER @ HOUGANG UP$24-HR IMMEDIATE HIRE - NEAR MRT SEMICONDUCTOR CHIPS PACKER @ HOUGANG

Rapid Recruitment Asia Pte Ltd

SGD12 - SGD24 每小时

Geylang

Posted

5 days ago

Flip Chip Bonding Process Engineer Flip Chip Bonding Process Engineer

Qualcomm

Undisclosed

Singapore

Posted

12 days ago

Senior Research Engineer II, fan-in-fan-out wafer-level pkg, 2.5D interposers, Adv Pkg, IME Senior Research Engineer II, fan-in-fan-out wafer-level pkg, 2.5D interposers, Adv Pkg, IME

A*STAR - Agency For Science, Technology And Research

Undisclosed

Singapore

Posted

15 days ago

FE ASSY DIE BOND PROCESS TECHNICIAN FE ASSY DIE BOND PROCESS TECHNICIAN

NXP

Undisclosed

KL City

Posted

15 days ago

Engineer, Yield Enhancement PDE (Package Development Engineering) Engineer, Yield Enhancement PDE (Package Development Engineering)

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

SGD4,800 - SGD4,800 每月

Singapore

Posted

16 days ago

Flip Chip Bonding Process Engineer Flip Chip Bonding Process Engineer

Qualcomm

Undisclosed

Singapore

Posted

17 days ago

Lead Research Engineer I, FOWLP integration, Adv Pkg, IME Lead Research Engineer I, FOWLP integration, Adv Pkg, IME

A*STAR - Agency For Science, Technology And Research

Undisclosed

Singapore

Posted

2 days ago

BGA WB Process Engineer BGA WB Process Engineer

NXP Semiconductors

Undisclosed

KL City

Posted

3 days ago

Lead Research Engineer I, FOWLP integration, Adv Pkg, IME Lead Research Engineer I, FOWLP integration, Adv Pkg, IME

A*STAR RESEARCH ENTITIES

SGD5,950 - SGD5,950 每月

Singapore

Posted

8 days ago

BGA WB Process Technician BGA WB Process Technician

NXP

Undisclosed

KL City

Posted

11 days ago

Staff Equipment Engineer (Advanced Packaging) Staff Equipment Engineer (Advanced Packaging)

Lumilens

Undisclosed

Singapore

Posted

12 days ago

Lead Research Engineer I, FOWLP integration, Adv Pkg, IME Lead Research Engineer I, FOWLP integration, Adv Pkg, IME

A*STAR - Agency For Science, Technology And Research

Undisclosed

Singapore

Posted

15 days ago

UP$24-HR IMMEDIATE HIRE - NEAR MRT SEMICONDUCTOR CHIPS PACKER @ HOUGANG UP$24-HR IMMEDIATE HIRE - NEAR MRT SEMICONDUCTOR CHIPS PACKER @ HOUGANG

Rapid Recruitment Asia Pte Ltd

SGD12 - SGD24 每小时

Geylang

Posted

24 days ago

UP$24-HR IMMEDIATE HIRE - NEAR MRT IT CHIPS PACKER @ HOUGANG UP$24-HR IMMEDIATE HIRE - NEAR MRT IT CHIPS PACKER @ HOUGANG

Rapid Recruitment Asia Pte Ltd

SGD12 - SGD24 每小时

Tai Seng

Posted

24 days ago

Process- Equipment Engineer (Advanced Packaging- Fan Out) Process- Equipment Engineer (Advanced Packaging- Fan Out)

TF-AMD Penang

Undisclosed

Malaysia

Posted

25 days ago

Sales Engineer (Penang, Ipoh, Kulim) Sales Engineer (Penang, Ipoh, Kulim)

UBoT Incorporated Limited

MYR4,000 - MYR5,000 每月

Degree holder with minimum 2–3 years working experience in semiconductor, electronics, EMS, or related industry.
Experience in semiconductor packaging materials and technical knowledge is an advantage.
Good communication, negotiation, and customer management skills. ...

Posted

21 hours ago

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