Education: Bachelor's Degree or Equivalent in Mechanical, Manufacturing, Process, Industrial Engineering, or a related discipline.
Core Competencies:
Solid understanding of manufacturing process optimization, engineering methodologies, and continuous improvement frameworks (e.g., Lean, Six Sigma).
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To support wire bond process engineering works and carry out yield, quality, cost savings, productivity improvements and documentation.
Degree in related discipline with min 5 years relevant working experience or graduate with the degree in any Electronics, Electrical, Mechanical or Mechatronics engineering course.
Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
Bachelor’s degree or higher in Material Science, Physics, Mechanical, or Chemical Engineering, or equivalent.
Knowledge of analytical tools such as Parametric Analyzer, Keithley Meter, TDR, EOTPR, SEM/EDX, FIB, FTIR, X-Ray, Acoustic Imaging, and IR Imaging tools.
Strong analytical thinking and problem-solving skills.
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Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.
Candidate must possess Degree in Electronics/Electrical Engineering and Mechanical or equivalent.
Basic technical knowledge in Electronic/Semiconductors.Familiar with SPC, FMEA, DOE, TPM, OCAP, JMP, RCA, Control Plan, Working Instruction, Predictive Maintenance.