Minimum qualification is a Diploma in Electronics/Microelectronics.
The candidate should have Failure Analysis experience in Package or Die level FA or Reliability analysis experience for a minimum of 1 year and above in semiconductor manufacturing related company.
Well versed in using FA & Rel related equipment such as Microscope, Parametric Analyzer, X-ray, CSAM, SEM-EDX, Decapper, TDR, Micro Prober station, FTIR, HAST, Bake oven, Reflow machine, TC chamber, Burn in oven and etc....
Education: Bachelor's Degree or Equivalent in Mechanical, Manufacturing, Process, Industrial Engineering, or a related discipline.
Core Competencies:
Solid understanding of manufacturing process optimization, engineering methodologies, and continuous improvement frameworks (e.g., Lean, Six Sigma)....
Good electro-mechanical equipment troubleshooting skills.
Read and orally communicate in Mandarin (writing ability not required).
Willing to travel
work under pressure and take on technical challenge.
Oversea work experience is a plus.
Microsoft Excel
Microsoft Word
Microsoft Powerpoint
Customer Service
Communication Skills
Multitasking
Communication
Sales Support
Administrative Assistance
Time Management
Problem-Solving
Order Processing
Data Entry